Legal Representation
Attorney
Christopher M. Spletzer, Sr.
Application History
2 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Nov 6, 2025 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
| Nov 6, 2025 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Equipment for semiconductor packaging, namely, die attach equipment, clip bonding equipment, and reflow ovens
Classification
International Classes
007