Legal Representation
Attorney
Timothy J. Feathers
Application History
2 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Sep 12, 2025 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
| Sep 12, 2025 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Equipment used in the manufacture of electronics structures, semiconductors, and flexible printed circuits; Equipment for processing inks and thin films; Thermal processing equipment used in curing, soldering, bonding, debonding and sintering applications and Photonic and pulsed light equipment used in curing, soldering, bonding, debonding and sintering applications
First Use Anywhere:
Sep 22, 2009
First Use in Commerce:
Sep 22, 2009
Classification
International Classes
007