LAIRD

Serial Number 99273013
686

Registration Progress

Application Filed
Jul 8, 2025
Under Examination
Approved for Publication
Oct 28, 2025
Published for Opposition
Oct 28, 2025
Registered

Attorney Assistance

Published for Opposition
Due: Nov 27, 2025 27 days

Trademark Image

LAIRD

Basic Information

Serial Number
99273013
Filing Date
July 8, 2025
Published for Opposition
October 28, 2025
Drawing Code
4

Status Summary

Current Status
Active
Status Code
686
Status Date
Oct 28, 2025
Application
Pending
Classes
017

Rights Holder

Laird Technologies, Inc.

03
Address
16401 Swingley Ridge Road, Suite 700
Chesterfield, MO 63017

Ownership History

Laird Technologies, Inc.

Original Applicant
03
Chesterfield, MO

Laird Technologies, Inc.

Owner at Publication
03
Chesterfield, MO

Legal Representation

Attorney
Joseph E. Walsh, Jr.

USPTO Deadlines

Next Deadline
27 days remaining
Published for Opposition
Due Date
November 27, 2025
Extension Available
Until December 27, 2025
Additional deadlines exist. Contact your attorney for complete deadline information.

Application History

8 events
Date Code Type Description Documents
Oct 28, 2025 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Oct 28, 2025 PUBO A PUBLISHED FOR OPPOSITION Loading...
Oct 22, 2025 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Sep 27, 2025 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Sep 20, 2025 DOCK D ASSIGNED TO EXAMINER Loading...
Jul 8, 2025 MAFR O APPLICATION FILING RECEIPT MAILED Loading...
Jul 8, 2025 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Jul 8, 2025 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 017
Microwave absorbers, namely, pastes, pads, and gels; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplastics, namely, semiprocessed thermoplastics in molded, extruded, and sheet form; Conductive plastics and elastomers, namely, putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices

Classification

International Classes
017