Legal Representation
Attorney
Tomoko Nakajima
USPTO Deadlines
Application History
11 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Aug 14, 2025 | GNS3 | O | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED | Loading... |
| Aug 14, 2025 | GNSL | F | LETTER OF SUSPENSION E-MAILED | Loading... |
| Aug 14, 2025 | CNSL | R | SUSPENSION LETTER WRITTEN | Loading... |
| Aug 14, 2025 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Aug 14, 2025 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Aug 14, 2025 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Aug 14, 2025 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Aug 14, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jul 10, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Mar 13, 2025 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
| Mar 13, 2025 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 001
Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin
Class 007
semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
Class 017
Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets for use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
Class 040
laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastic films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer
Classification
International Classes
001
007
017
040