PCBL

Serial Number 99082749
630

Registration Progress

Application Filed
Mar 13, 2025
Under Examination
Approved for Publication
Published for Opposition
Registered

Basic Information

Serial Number
99082749
Filing Date
March 13, 2025
Drawing Code
4

Status Summary

Current Status
Active
Status Code
630
Status Date
Mar 13, 2025
Application
Pending
Classes
001 007 017 040

Rights Holder

Lintec Kabushiki Kaisha

03
Address
23-23, Honcho, Itabashi-ku
Tokyo 173-0001
JP

Ownership History

Lintec Kabushiki Kaisha

Original Applicant
03
Tokyo JP

Legal Representation

Attorney
Tomoko Nakajima

Application History

2 events
Date Code Type Description
Mar 13, 2025 MAFR O APPLICATION FILING RECEIPT MAILED
Mar 13, 2025 NWAP I NEW APPLICATION ENTERED

Detailed Classifications

Class 001
Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin
Class 007
semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
Class 017
Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets fo use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
Class 040
laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastc films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer

Classification

International Classes
001 007 017 040