Legal Representation
Attorney
MAX VERN
USPTO Deadlines
Application History
11 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jun 12, 2025 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Jun 12, 2025 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Jun 12, 2025 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Mar 14, 2025 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Mar 14, 2025 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Mar 14, 2025 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Mar 14, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Mar 13, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Mar 13, 2025 | MDSC | E | NOTICE OF DESIGN SEARCH CODE E-MAILED | Loading... |
| Feb 12, 2025 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
| Feb 12, 2025 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Metalworking machines; industrial robots; industrial robots for assembling electronic circuit; semiconductor wafer processing machines; chip mounting machines for semiconductor processing; vision system for inspecting, placing and aligning devices comprising electronic cameras, optics, illuminators and image processing electronics; semiconductor wafer treatment equipment; wire bonding machine for semiconductor; mounting machines for semiconductor chip manufacturing; functional testing machines for semiconductor assembling apparatus; die bonding machines used in manufacturing microchips and semiconductors; loading and unloading machines; vertical carriers loading and unloading machines; wire bonding machines used in manufacturing microchips and semiconductors; flip chip bonding machines; chip mounters, namely, mounting machines for mounting microchips, semiconductor chips, semiconductor components and electronic components; handling apparatus for loading and unloading machine; auto loading machines for lead frames; fluid dispensers being parts of semiconductor processing machines; machines for manufacturing semiconductors; printed circuit boards (PCBs)
Additional Information
Design Mark
The mark consists of wording HANWHA SEMITECH in black to the left of which are three overlapping rings of differing sizes in three shades of orange, namely, orange, light orange and pale orange.
Color Claim
The color(s) black, orange, light orange and pale orange is/are claimed as a feature of the mark.
Classification
International Classes
007