XERDIA

Serial Number 99002380
641

Registration Progress

Application Filed
Jan 16, 2025
Under Examination
Approved for Publication
Published for Opposition
Registered

Attorney Assistance

Notification of Non-Final Action E-Mailed
Due: Oct 04, 2025 88 days

Basic Information

Serial Number
99002380
Deadline
October 4, 2025
Description
Respond to Non-Final Office Action
Filing Date
January 16, 2025
Drawing Code
5

Status Summary

Current Status
Active
Status Code
641
Status Date
Jul 4, 2025
Application
Pending
Classes
007 037

Rights Holder

Fasford Technology Co., Ltd.

03
Address
610-5 Shimoimasuwa,
Minami-Alps City, Yamanashi Pref. 400-0212
JP

Ownership History

Fasford Technology Co., Ltd.

Original Applicant
03
Minami-Alps City, Yamanashi Pref. JP

Legal Representation

Attorney
Matthew L. Frisbee

USPTO Deadlines

Next Deadline
88 days remaining
Notification of Non-Final Action E-Mailed
Due Date
October 04, 2025
Extension Available
Until January 04, 2026
Additional deadlines exist. Contact your attorney for complete deadline information.

Application History

10 events
Date Code Type Description
Jul 4, 2025 CNRT R NON-FINAL ACTION WRITTEN
Jul 4, 2025 GNRT F NON-FINAL ACTION E-MAILED
Jul 4, 2025 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED
Jun 26, 2025 DOCK D ASSIGNED TO EXAMINER
Jun 17, 2025 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Jun 17, 2025 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED
Jun 17, 2025 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Jun 17, 2025 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Jan 16, 2025 MAFR O APPLICATION FILING RECEIPT MAILED
Jan 16, 2025 NWAP I NEW APPLICATION ENTERED

Detailed Classifications

Class 007
washing apparatus for semiconductor wafers; integrated circuit bonding tools and parts thereof; die bonders for manufacturing semiconductor elements; flip chip bonding equipment for manufacturing semiconductors; semiconductor exposure apparatus for use in manufacture; semiconductor wafer ashing equipment; semiconductor wafer etching equipment; semiconductor wafer processing equipment; die bonding equipment for manufacturing semiconductors; semiconductor wafer processing machines; semiconductor wafer surface polishing equipment; adhesive application equipment for semiconductor manufacturing machines; semiconductor manufacturing machines; machines for attaching tapes of semiconductor wafers; memory chip manufacturing machines; machines for manufacturing semiconductors; plasma etching machines; machines for cutting semiconductor wafers and parts thereof
Class 037
repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems; providing information relating to the repair or maintenance of integrated circuits manufacturing machines and systems; providing information relating to the repair or maintenance of semi-conductor manufacturing machines and systems

Additional Information

Design Mark
The mark consists of the letters XERDIA in stylized font.

Classification

International Classes
007 037