Legal Representation
Attorney
Sangwon Kim
USPTO Deadlines
Application History
12 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jun 17, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jun 17, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jun 11, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| May 13, 2025 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| May 13, 2025 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| May 13, 2025 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| May 13, 2025 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| May 13, 2025 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| May 7, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| May 5, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| May 5, 2025 | MDSC | E | NOTICE OF DESIGN SEARCH CODE E-MAILED | Loading... |
| Nov 11, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Die attachment equipment for manufacturing semiconductor, namely, dies for use with machine tools; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; die bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; electronic components placement machines and apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; semiconductor chip mounting equipment in the nature of semiconductor manufacturing machines; semiconductor package electromagnetic shielding equipment in the nature of semiconductor manufacturing machines; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines
First Use Anywhere:
Dec 1, 2000
First Use in Commerce:
Dec 1, 2000
Additional Information
Design Mark
The mark consists of the word "HANMI" in blue surrounded by a red frame with straight and curved features, the white in the mark representing a transparent area.
Color Claim
The color(s) blue and red is/are claimed as a feature of the mark.
Classification
International Classes
007