Legal Representation
Attorney
Christopher M. Spletzer, Sr.
USPTO Deadlines
Next Deadline
183 days remaining
NOA E-Mailed - SOU Required
Due Date
July 22, 2026
Extension Available
Until January 22, 2027
Application History
16 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Dec 5, 2025 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
| Dec 4, 2025 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| Dec 4, 2025 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Dec 4, 2025 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Jul 22, 2025 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| May 27, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| May 27, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| May 21, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Apr 28, 2025 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Apr 28, 2025 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Apr 28, 2025 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Apr 28, 2025 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Apr 28, 2025 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Apr 21, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Apr 18, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Oct 11, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Machines for electronics assembly, particularly in the semiconductor assembly field, and specifically for die attach machines and thermocompression bonding machines and flip chip bonding machines
Class 040
Electronics assembly using operating machines for processing in the field of semiconductor assembly using die attach processes, thermocompression bonding processes, and flip chip bonding processes; Electronics assembly using computer controlled operating machines for processing in the field of semiconductor assembly using die attach processes, thermocompression bonding processes, and flip chip bonding processes
Additional Information
Pseudo Mark
CU FIRST
Classification
International Classes
007
040