ATARU

Serial Number 98661542
774

Registration Progress

Application Filed
Jul 23, 2024
Under Examination
Approved for Publication
Feb 25, 2025
Published for Opposition
Feb 25, 2025
Registered

Trademark Image

ATARU

Basic Information

Serial Number
98661542
Filing Date
July 23, 2024
Published for Opposition
February 25, 2025
Drawing Code
4

Status Summary

Current Status
Active
Status Code
774
Status Date
Mar 26, 2025
Application
Pending
Classes
017

Rights Holder

Nano Dimension Technologies, LTD.

03
Address
Ilan Ramon 2
Nes Ziona 7403635
IL

Ownership History

Nano Dimension Technologies, LTD.

Original Applicant
03
Nes Ziona IL

Nano Dimension Technologies, LTD.

Owner at Publication
03
Nes Ziona IL

Legal Representation

Attorney
JACQUELINE ZION

USPTO Deadlines

All Deadlines Cleared

All 2 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

13 events
Date Code Type Description Documents
Mar 26, 2025 OP.I T OPPOSITION INSTITUTED NO. 999999 Loading...
Mar 26, 2025 OPPF T OPPOSITION PAPERS RECEIVED AT TTAB Loading...
Feb 25, 2025 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Feb 25, 2025 PUBO A PUBLISHED FOR OPPOSITION Loading...
Feb 19, 2025 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Feb 3, 2025 XAEC I EXAMINER'S AMENDMENT ENTERED Loading...
Feb 3, 2025 GNEA F EXAMINERS AMENDMENT E-MAILED Loading...
Feb 3, 2025 GNEN O NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED Loading...
Feb 3, 2025 CNEA R EXAMINERS AMENDMENT -WRITTEN Loading...
Feb 3, 2025 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Jan 30, 2025 DOCK D ASSIGNED TO EXAMINER Loading...
Jan 16, 2025 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Jul 23, 2024 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 017
Insulating materials; insulating coating materials for use with printed circuit boards; insulating resin materials for liquid intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film-type intermediate dielectric materials for use on build-up boards; insulating coating materials for use with display panels; insulating materials in the nature of a solder mask for use with printed circuit boards; insulating protecting filling and plugging materials for use with holes of printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; dielectric material for use in three-dimensional printing.

Classification

International Classes
017