Legal Representation
Attorney
Cynthia L. Pillote
USPTO Deadlines
Next Deadline
118 days remaining
NOA E-Mailed - SOU Required
Due Date
March 02, 2026
Extension Available
Until September 02, 2026
Application History
22 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Sep 2, 2025 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jul 8, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jul 8, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jul 2, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Jun 2, 2025 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Jun 2, 2025 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Jun 2, 2025 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Jun 2, 2025 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Jun 2, 2025 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Apr 28, 2025 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Apr 28, 2025 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Apr 28, 2025 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Apr 28, 2025 | EWAF | I | TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS | Loading... |
| Apr 28, 2025 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Apr 28, 2025 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
| Apr 28, 2025 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
| Jan 28, 2025 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Jan 28, 2025 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Jan 28, 2025 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Jan 22, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 14, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jul 3, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Machines and machine tools for the assembly and packaging of electronic chips and structural parts and fittings therefor; machines for manufacturing semiconductors, and structural parts and fittings therefor; semiconductor manufacturing machines; semiconductor manufacturing machines and systems composed of a vacuum chamber for accommodating semiconductor wafers and structural parts and fittings therefor; structural parts and machines for handling and transferring semiconductor wafers into and out of vacuum chambers, and structural parts and fittings therefor; machines and machine tools for the treatment of semiconductor wafers, namely, thermal treatment reactors and chemical vapor deposition reactors, chemical reactors for the thermal treatment of semiconductor wafers; machines for the plasma assisted manufacture of semiconductors, namely, vacuum treatment machines for plasma assisted deposition, and vacuum machines for depositing fine films; plasma enhanced deposition machines, namely, semiconductor manufacturing machines utilizing plasma-enhanced deposition, and structural parts and fittings therefor; industrial surface treatment equipment, namely, vacuum plasma treatment systems comprised of a high frequency, high voltage generator, controls, and treatment chamber, and structural fittings and parts therefor; semiconductor wafer processing reactors for the chemical treatment and the thermal treatment of semiconductor wafers and for the chemical cleaning of semiconductor wafers by means of a gas phase process, also with the use of plasma, namely, gas discharge industrial chemical reactors, and structural parts and fittings therefor; industrial robots for the handling of semiconductor wafers; industrial gas-phase reactors for processing semiconductor wafers, namely, chemical reactors for the thermal treatment of semiconductor wafers and reactors for chemical vapor deposition for depositing thin films on semiconductor wafers; industrial gas-phase semiconductor wafer processing reactors for the chemical treatment and the thermal treatment of semiconductor wafers and for the chemical cleaning of semiconductor wafers by means of a gas phase process, also with the use of gas discharge; and structural and replacement parts for the aforementioned products
Class 009
Electrical reactors for processing semiconductor wafers; laboratory gas-phase reactors for processing semiconductor wafers, namely, chemical reactors for the thermal treatment of semiconductor wafers and reactors for chemical vapor deposition for depositing thin films on semiconductor wafers; laboratory chemical reactors; laboratory gas-phase semiconductor wafer processing reactors for the chemical treatment and the thermal treatment of semiconductor wafers and for the chemical cleaning of semiconductor wafers by means of a gas phase process, also with the use of gas discharge; and structural and replacement parts for the aforementioned products; robots being electronic control devices, namely, laboratory robots; electronic controllers for industrial robots for use by the semiconductor industry; electronic controllers for controlling semiconductor wafer processing machines; electronic control systems for semiconductor manufacturing machines; structural parts and fittings for the aforementioned goods
Additional Information
Translation
The word(s) "ARIUS" has no meaning in a foreign language.
Classification
International Classes
007
009