Legal Representation
Attorney
Katrin Lewertoff
USPTO Deadlines
Next Deadline
1938 days remaining
Section 8 Declaration Due (Principal Register) (Based on registration date 20250408)
Due Date
April 08, 2031
Grace Period Ends
October 08, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
9 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Apr 8, 2025 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Apr 8, 2025 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Feb 18, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Feb 18, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Feb 12, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Jan 27, 2025 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Jan 21, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 14, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jul 1, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Automatic laser cutting machines for glass; Automatic laser cutting machines for ceramic substrates; Automatic laser cutting machines for semiconductor substrates; Automatic laser chamfering machines for glass; Automatic laser chamfering machines for ceramic substrates; Automatic laser chamfering machines for semiconductor substrates; Laser working machines for scribing and breaking glass; Laser working machines for scribing and breaking ceramic substrates; Laser working machines for scribing and breaking semiconductor substrates; Machines for manufacturing for flat panel display screens; Machines for manufacturing for semiconductors; Cemented carbide tools for scribing glass; Diamond tools, namely, diamond-pointed tools for scribing glass; Diamond grinding machines; Metalworking machines, namely, grinding machines; Automatic cutting machines for glass; Automatic cutting machines for semiconductor substrates; Automatic chamfering machines for glass; Automatic chamfering machines for semiconductor substrates; Glass working machines for scribing and breaking glass; Working machines for scribing and breaking semiconductor substrates; Automatic cutting machines for ceramic substrates; Automatic chamfering machines for ceramic substrates; Working machines for ceramic substrates for scribing and breaking
Classification
International Classes
007