Legal Representation
Attorney
Katrin Lewertoff
USPTO Deadlines 2 active
| Deadline Type | Event Code | Deadline Date | Days Until | Priority | Extension Available |
|---|---|---|---|---|---|
|
MAINTENANCE
Section 8 (6-Year) Declaration Due (Based on registration date 2025-04-08) |
R.PRA | Apr 08, 2031 | 2101 days | Critical | No |
|
MAINTENANCE
Section 8 & 9 (10-Year) Renewal Due (Based on registration date 2025-04-08) |
R.PRA | Apr 08, 2035 | 3562 days | Critical | No |
Next deadline: Section 8 (6-Year) Declaration Due (Based on registration date 2025-04-08)
on April 08, 2031
(2101 days)
Application History
9 events| Date | Code | Type | Description |
|---|---|---|---|
| Apr 8, 2025 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| Apr 8, 2025 | R.PR | A | REGISTERED-PRINCIPAL REGISTER |
| Feb 18, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Feb 18, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION |
| Feb 12, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Jan 27, 2025 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Jan 21, 2025 | DOCK | D | ASSIGNED TO EXAMINER |
| Jan 14, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Jul 1, 2024 | NWAP | I | NEW APPLICATION ENTERED |
Detailed Classifications
Class 007
Automatic laser cutting machines for glass; Automatic laser cutting machines for ceramic substrates; Automatic laser cutting machines for semiconductor substrates; Automatic laser chamfering machines for glass; Automatic laser chamfering machines for ceramic substrates; Automatic laser chamfering machines for semiconductor substrates; Laser working machines for scribing and breaking glass; Laser working machines for scribing and breaking ceramic substrates; Laser working machines for scribing and breaking semiconductor substrates; Machines for manufacturing for flat panel display screens; Machines for manufacturing for semiconductors; Cemented carbide tools for scribing glass; Diamond tools, namely, diamond-pointed tools for scribing glass; Diamond grinding machines; Metalworking machines, namely, grinding machines; Automatic cutting machines for glass; Automatic cutting machines for semiconductor substrates; Automatic chamfering machines for glass; Automatic chamfering machines for semiconductor substrates; Glass working machines for scribing and breaking glass; Working machines for scribing and breaking semiconductor substrates; Automatic cutting machines for ceramic substrates; Automatic chamfering machines for ceramic substrates; Working machines for ceramic substrates for scribing and breaking
Active Deadlines
Section 8 (6-Year) Declaration Due (Based on registration date 2025-04-08)
Due: Apr 08, 2031
Grace Period Until: Oct 08, 2031
Section 8 & 9 (10-Year) Renewal Due (Based on registration date 2025-04-08)
Due: Apr 08, 2035
Grace Period Until: Oct 08, 2035
Classification
International Classes
007