Legal Representation
Attorney
Christopher M. Spletzer, Sr.
USPTO Deadlines
Application History
8 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jun 9, 2025 | MAB2 | E | ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND | Loading... |
| Jun 9, 2025 | ABN2 | O | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | Loading... |
| Jan 21, 2025 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Jan 21, 2025 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Jan 21, 2025 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Jan 21, 2025 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 17, 2025 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jun 25, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Electronics assembly equipment and consummables and component parts for such equipment, material handling system for electronics assembly equipment, factory automation equipment for electronics assembly, factory automation equipment for semiconductor packaging, semiconductor packaging equipment, material handling system for semiconductor packaging equipment, wire bonding equipment, semiconductor interconnection equipment, stud bumping equipment, semiconductor die attach equipment, flip chip bonding equipment, thermocompression bonding equipment, laser bonding equipment, laser based electronic component transfer and placement equipment, electronic component transfer and placement equipment, ultrasonic welding equipment, clip attach equipment, pick and place equipment, lithographic equipment, fluid dispensing equipment, inspection equipment, wire bonding tools, sonotrodes, die attach tools, semiconductor dicing blades, dispensing equipment consumables, dispensing equipment nozzles
Class 009
Downloadable software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging
Class 042
Online platform featuring information and software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging
Additional Information
Design Mark
The mark consists of the letter K and the letter S, with an ampersand symbol between the K and the S, the lower right leg of the K being merged with the lower left portion of the ampersand symbol, and the lower left portion of the S being merged with the lower right portion of the ampersand symbol.
Color Claim
Color is not claimed as a feature of the mark.
Pseudo Mark
K AND S
Classification
International Classes
007
009
042