Legal Representation
Attorney
Christopher M. Spletzer, Sr.
USPTO Deadlines
Application History
8 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Apr 3, 2025 | MAB2 | E | ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND | Loading... |
| Apr 3, 2025 | ABN2 | O | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | Loading... |
| Dec 16, 2024 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Dec 16, 2024 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Dec 16, 2024 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Dec 11, 2024 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Dec 6, 2024 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| May 29, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Electronics assembly equipment and consummables and component parts for such equipment, material handling system for electronics assembly equipment, factory automation equipment for electronics assembly, factory automation equipment for semiconductor packaging, semiconductor packaging equipment, material handling system for semiconductor packaging equipment, wire bonding equipment, semiconductor interconnection equipment, stud bumping equipment, semiconductor die attach equipment, flip chip bonding equipment, thermocompression bonding equipment, laser bonding equipment, laser based electronic component transfer and placement equipment, electronic component transfer and placement equipment, ultrasonic welding equipment, clip attach equipment, pick and place equipment, lithographic equipment, fluid dispensing equipment, inspection equipment, wire bonding tools, sonotrodes, die attach tools, semiconductor dicing blades, dispensing equipment consumables, dispensing equipment nozzles
Class 009
downloadable software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging
Class 042
online platform featuring information and software for electronics assembly equipment, semiconductor packaging equipment, wire bonding equipment, pick and place equipment, factory automation for electronics assembly and semiconductor packaging
Additional Information
Pseudo Mark
K PLUS S
Classification
International Classes
007
009
042