Legal Representation
Attorney
Barry I. Hollander
USPTO Deadlines
Next Renewal Deadline
2163 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2025-06-10)
Due Date
June 10, 2031
Grace Period Ends
December 10, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
18 events| Date | Code | Type | Description |
|---|---|---|---|
| Jun 10, 2025 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| Jun 10, 2025 | R.PR | A | REGISTERED-PRINCIPAL REGISTER |
| Apr 22, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Apr 22, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION |
| Apr 16, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Mar 27, 2025 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Mar 27, 2025 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Mar 27, 2025 | XAEC | I | EXAMINER'S AMENDMENT ENTERED |
| Mar 27, 2025 | GNEA | F | EXAMINERS AMENDMENT E-MAILED |
| Mar 27, 2025 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN |
| Jan 6, 2025 | XELR | I | APPLICATION EXTENSION TO RESPONSE PERIOD - RECEIVED |
| Jan 6, 2025 | XELG | O | APPLICATION EXTENSION GRANTED/RECEIPT PROVIDED |
| Oct 4, 2024 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Oct 4, 2024 | GNRT | F | NON-FINAL ACTION E-MAILED |
| Oct 4, 2024 | CNRT | R | NON-FINAL ACTION WRITTEN |
| Sep 17, 2024 | DOCK | D | ASSIGNED TO EXAMINER |
| Jul 13, 2024 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Mar 1, 2024 | NWAP | I | NEW APPLICATION ENTERED |
Detailed Classifications
Class 001
Industrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; metal plating solution, metal plating solution additive, metal plating additives for use in package substrate, and printed circuit boards; chemical metal plating solution, chemical metal plating solution additive, chemical metal plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in package substrate, and printed circuit boards
Classification
International Classes
001