Legal Representation
Attorney
Barry I. Hollander
USPTO Deadlines
Next Deadline
2000 days remaining
Section 8 Declaration Due (Principal Register) (Based on registration date 20250610)
Due Date
June 10, 2031
Grace Period Ends
December 10, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
18 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jun 10, 2025 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Jun 10, 2025 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Apr 22, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Apr 22, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Apr 16, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Mar 27, 2025 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Mar 27, 2025 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Mar 27, 2025 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Mar 27, 2025 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Mar 27, 2025 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Jan 6, 2025 | XELG | O | APPLICATION EXTENSION GRANTED/RECEIPT PROVIDED | Loading... |
| Jan 6, 2025 | XELR | I | APPLICATION EXTENSION TO RESPONSE PERIOD - RECEIVED | Loading... |
| Oct 4, 2024 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Oct 4, 2024 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Oct 4, 2024 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Sep 17, 2024 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jul 13, 2024 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Mar 1, 2024 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 001
Industrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; metal plating solution, metal plating solution additive, metal plating additives for use in package substrate, and printed circuit boards; chemical metal plating solution, chemical metal plating solution additive, chemical metal plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in package substrate, and printed circuit boards
Classification
International Classes
001