Legal Representation
Attorney
Barry I. Hollander
USPTO Deadlines
Next Deadline
148 days remaining
Statement of Use Due - Extension 1 Granted
Due Date
December 03, 2025
Extension Available
Until December 03, 2025
Application History
22 events| Date | Code | Type | Description |
|---|---|---|---|
| May 9, 2025 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| May 8, 2025 | EX1G | S | SOU EXTENSION 1 GRANTED |
| May 8, 2025 | EXT1 | S | SOU EXTENSION 1 FILED |
| May 8, 2025 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
| Dec 3, 2024 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| Oct 22, 2024 | PUBO | A | PUBLISHED FOR OPPOSITION |
| Oct 22, 2024 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Oct 2, 2024 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Sep 12, 2024 | XAEC | I | EXAMINER'S AMENDMENT ENTERED |
| Sep 12, 2024 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Sep 12, 2024 | GNEA | F | EXAMINERS AMENDMENT E-MAILED |
| Sep 12, 2024 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Sep 12, 2024 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN |
| Jun 22, 2024 | GNRT | F | NON-FINAL ACTION E-MAILED |
| Jun 22, 2024 | CNRT | R | NON-FINAL ACTION WRITTEN |
| Jun 22, 2024 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Jun 20, 2024 | DOCK | D | ASSIGNED TO EXAMINER |
| Jun 20, 2024 | GNRT | F | NON-FINAL ACTION E-MAILED |
| Jun 20, 2024 | CNRT | R | NON-FINAL ACTION WRITTEN |
| Jun 20, 2024 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Dec 19, 2023 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Nov 17, 2023 | NWAP | I | NEW APPLICATION ENTERED |
Detailed Classifications
Class 001
Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards
Additional Information
Translation
The wording "NEZARK" has no meaning in a foreign language.
Classification
International Classes
001