NEZARK

Serial Number 98269503
731

Registration Progress

Application Filed
Nov 14, 2023
Under Examination
Dec 3, 2024
Approved for Publication
Oct 22, 2024
Published for Opposition
Oct 22, 2024
Registered

Attorney Assistance

NOA E-Mailed - SOU Required
Due: Jun 03, 2026 168 days

Trademark Image

NEZARK

Basic Information

Serial Number
98269503
Filing Date
November 14, 2023
Published for Opposition
October 22, 2024
Drawing Code
4

Status Summary

Current Status
Active
Status Code
731
Status Date
Nov 25, 2025
Application
Pending
Classes
001

Rights Holder

JCU CORPORATION

03
Address
8-1 Higashiueno 4-chome Taito-ku,
Tokyo 110-0015
JP

Ownership History

JCU CORPORATION

Original Applicant
03
Tokyo JP

JCU CORPORATION

Owner at Publication
03
Tokyo JP

Legal Representation

Attorney
Barry I. Hollander

USPTO Deadlines

Next Deadline
168 days remaining
NOA E-Mailed - SOU Required
Due Date
June 03, 2026
Extension Available
Until December 03, 2026

Application History

26 events
Date Code Type Description Documents
Nov 26, 2025 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Nov 25, 2025 EX2G S SOU EXTENSION 2 GRANTED Loading...
Nov 25, 2025 EXT2 S SOU EXTENSION 2 FILED Loading...
Nov 25, 2025 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
May 9, 2025 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
May 8, 2025 EX1G S SOU EXTENSION 1 GRANTED Loading...
May 8, 2025 EXT1 S SOU EXTENSION 1 FILED Loading...
May 8, 2025 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Dec 3, 2024 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Oct 22, 2024 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Oct 22, 2024 PUBO A PUBLISHED FOR OPPOSITION Loading...
Oct 2, 2024 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Sep 12, 2024 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Sep 12, 2024 XAEC I EXAMINER'S AMENDMENT ENTERED Loading...
Sep 12, 2024 GNEN O NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED Loading...
Sep 12, 2024 GNEA F EXAMINERS AMENDMENT E-MAILED Loading...
Sep 12, 2024 CNEA R EXAMINERS AMENDMENT -WRITTEN Loading...
Jun 22, 2024 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Jun 22, 2024 GNRT F NON-FINAL ACTION E-MAILED Loading...
Jun 22, 2024 CNRT R NON-FINAL ACTION WRITTEN Loading...
Jun 20, 2024 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Jun 20, 2024 GNRT F NON-FINAL ACTION E-MAILED Loading...
Jun 20, 2024 CNRT R NON-FINAL ACTION WRITTEN Loading...
Jun 20, 2024 DOCK D ASSIGNED TO EXAMINER Loading...
Dec 19, 2023 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Nov 17, 2023 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 001
Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards

Additional Information

Translation
The wording "NEZARK" has no meaning in a foreign language.

Classification

International Classes
001