QCIA

Serial Number 97767075
731

Registration Progress

Application Filed
Jan 25, 2023
Under Examination
Jun 18, 2024
Approved for Publication
Apr 23, 2024
Published for Opposition
Apr 23, 2024
Registered

Attorney Assistance

Statement of Use Due - Extension 2 Granted
Due: Dec 18, 2025 148 days

Trademark Image

QCIA

Basic Information

Serial Number
97767075
Filing Date
January 25, 2023
Published for Opposition
April 23, 2024
Drawing Code
4

Status Summary

Current Status
Active
Status Code
731
Status Date
Jun 16, 2025
Application
Pending
Classes
009 042

Rights Holder

Salama, Islam

01
Address
10140 E Caron Street
Scottsdale, AZ 85258

Ownership History

Salama, Islam

Original Applicant
01
Scottsdale, AZ

Salama, Islam

Owner at Publication
01
Scottsdale, AZ

Legal Representation

Attorney
Daniel R. Frijouf

USPTO Deadlines

Next Deadline
148 days remaining
Statement of Use Due - Extension 2 Granted
Due Date
December 18, 2025
Extension Available
Until June 18, 2025

Application History

23 events
Date Code Type Description Documents
Jun 17, 2025 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Jun 16, 2025 EX2G S SOU EXTENSION 2 GRANTED Loading...
Jun 16, 2025 EXT2 S SOU EXTENSION 2 FILED Loading...
Jun 16, 2025 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Mar 3, 2025 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Dec 17, 2024 EX1G S SOU EXTENSION 1 GRANTED Loading...
Dec 17, 2024 EXT1 S SOU EXTENSION 1 FILED Loading...
Dec 17, 2024 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Jun 18, 2024 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Apr 23, 2024 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Apr 23, 2024 PUBO A PUBLISHED FOR OPPOSITION Loading...
Apr 3, 2024 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Apr 3, 2024 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Mar 19, 2024 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Feb 12, 2024 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Feb 12, 2024 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Feb 12, 2024 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Nov 13, 2023 GPRN O NOTIFICATION OF PRIORITY ACTION E-MAILED Loading...
Nov 13, 2023 GPRA F PRIORITY ACTION E-MAILED Loading...
Nov 13, 2023 CPRA R PRIORITY ACTION WRITTEN Loading...
Oct 24, 2023 DOCK D ASSIGNED TO EXAMINER Loading...
Feb 13, 2023 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Jan 28, 2023 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 009
Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device
Class 042
Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking

Classification

International Classes
009 042