Legal Representation
Attorney
Daniel R. Frijouf
USPTO Deadlines
Next Deadline
148 days remaining
Statement of Use Due - Extension 2 Granted
Due Date
December 18, 2025
Extension Available
Until June 18, 2025
Application History
23 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Jun 17, 2025 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
Jun 16, 2025 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
Jun 16, 2025 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
Jun 16, 2025 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Mar 3, 2025 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
Dec 17, 2024 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
Dec 17, 2024 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
Dec 17, 2024 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Jun 18, 2024 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
Apr 23, 2024 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
Apr 23, 2024 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
Apr 3, 2024 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
Apr 3, 2024 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
Mar 19, 2024 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
Feb 12, 2024 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
Feb 12, 2024 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Feb 12, 2024 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
Nov 13, 2023 | GPRN | O | NOTIFICATION OF PRIORITY ACTION E-MAILED | Loading... |
Nov 13, 2023 | GPRA | F | PRIORITY ACTION E-MAILED | Loading... |
Nov 13, 2023 | CPRA | R | PRIORITY ACTION WRITTEN | Loading... |
Oct 24, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Feb 13, 2023 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
Jan 28, 2023 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 009
Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device
Class 042
Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking
Classification
International Classes
009
042