Legal Representation
Attorney
Daniel R. Frijouf
USPTO Deadlines
Next Deadline
2042 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2025-03-04)
Due Date
March 04, 2031
Grace Period Ends
September 04, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
23 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Mar 4, 2025 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Mar 4, 2025 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Feb 7, 2025 | SUNA | E | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED | Loading... |
| Feb 7, 2025 | CNPR | P | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED | Loading... |
| Feb 2, 2025 | AITU | A | CASE ASSIGNED TO INTENT TO USE PARALEGAL | Loading... |
| Feb 2, 2025 | SUPC | I | STATEMENT OF USE PROCESSING COMPLETE | Loading... |
| Nov 19, 2024 | EISU | I | TEAS STATEMENT OF USE RECEIVED | Loading... |
| Nov 19, 2024 | IUAF | S | USE AMENDMENT FILED | Loading... |
| May 21, 2024 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Mar 26, 2024 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Mar 26, 2024 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Mar 6, 2024 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Mar 6, 2024 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Feb 16, 2024 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Feb 12, 2024 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Feb 12, 2024 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Feb 12, 2024 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 13, 2023 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Nov 13, 2023 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Nov 13, 2023 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Oct 24, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Feb 13, 2023 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jan 28, 2023 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 040
Custom fabrication of electronic and microelectronic systems, devices and components in the nature of interconnect device for microelectronic packaging, microelectronic device for die to die interconnect, microelectronic device for die stacking or stacking of microelectronic chips, microelectronic interposer device for connecting multiple semiconductor chips to microelectronic substrates, circuits for central processing units packaging, and circuits for high band width memory packaging, electronic data processing, automotive electronics, defense and military system electronics and consumer electronics
First Use Anywhere:
Jul 3, 2024
First Use in Commerce:
Jul 3, 2024
Class 042
Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking
First Use Anywhere:
Jul 3, 2024
First Use in Commerce:
Jul 3, 2024
Classification
International Classes
040
042