QCP

Serial Number 97767061
Registration 7716090
700

Registration Progress

Application Filed
Jan 25, 2023
Under Examination
May 21, 2024
Approved for Publication
Mar 6, 2024
Published for Opposition
Mar 26, 2024
Registered
Mar 4, 2025

Trademark Image

QCP

Basic Information

Serial Number
97767061
Registration Number
7716090
Filing Date
January 25, 2023
Registration Date
March 4, 2025
Published for Opposition
March 26, 2024
Drawing Code
4

Status Summary

Current Status
Active
Status Code
700
Status Date
Mar 4, 2025
Registration
Registered
Classes
040 042

Rights Holder

Salama, Islam

01
Address
10140 E Caron Street
Scottsdale, AZ 85258

Ownership History

Salama, Islam

Original Applicant
01
Scottsdale, AZ

Salama, Islam

Owner at Publication
01
Scottsdale, AZ

Salama, Islam

Original Registrant
01
Scottsdale, AZ

Legal Representation

Attorney
Daniel R. Frijouf

USPTO Deadlines

Next Deadline
2043 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2025-03-04)
Due Date
March 04, 2031
Grace Period Ends
September 04, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.

Application History

23 events
Date Code Type Description Documents
Mar 4, 2025 R.PR A REGISTERED-PRINCIPAL REGISTER Loading...
Mar 4, 2025 NRCC E NOTICE OF REGISTRATION CONFIRMATION EMAILED Loading...
Feb 7, 2025 SUNA E NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED Loading...
Feb 7, 2025 CNPR P ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED Loading...
Feb 2, 2025 AITU A CASE ASSIGNED TO INTENT TO USE PARALEGAL Loading...
Feb 2, 2025 SUPC I STATEMENT OF USE PROCESSING COMPLETE Loading...
Nov 19, 2024 EISU I TEAS STATEMENT OF USE RECEIVED Loading...
Nov 19, 2024 IUAF S USE AMENDMENT FILED Loading...
May 21, 2024 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Mar 26, 2024 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Mar 26, 2024 PUBO A PUBLISHED FOR OPPOSITION Loading...
Mar 6, 2024 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Mar 6, 2024 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Feb 16, 2024 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Feb 12, 2024 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Feb 12, 2024 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Feb 12, 2024 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Nov 13, 2023 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Nov 13, 2023 GNRT F NON-FINAL ACTION E-MAILED Loading...
Nov 13, 2023 CNRT R NON-FINAL ACTION WRITTEN Loading...
Oct 24, 2023 DOCK D ASSIGNED TO EXAMINER Loading...
Feb 13, 2023 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Jan 28, 2023 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 040
Custom fabrication of electronic and microelectronic systems, devices and components in the nature of interconnect device for microelectronic packaging, microelectronic device for die to die interconnect, microelectronic device for die stacking or stacking of microelectronic chips, microelectronic interposer device for connecting multiple semiconductor chips to microelectronic substrates, circuits for central processing units packaging, and circuits for high band width memory packaging, electronic data processing, automotive electronics, defense and military system electronics and consumer electronics
First Use Anywhere: Jul 3, 2024
First Use in Commerce: Jul 3, 2024
Class 042
Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking
First Use Anywhere: Jul 3, 2024
First Use in Commerce: Jul 3, 2024

Classification

International Classes
040 042