Legal Representation
Attorney
Jong Park
USPTO Deadlines
Next Deadline
1820 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2024-11-05)
Due Date
November 05, 2030
Grace Period Ends
May 05, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
21 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Nov 5, 2024 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Nov 5, 2024 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Aug 20, 2024 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Aug 20, 2024 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jul 31, 2024 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Jul 11, 2024 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Mar 28, 2024 | ERFR | I | TEAS REQUEST FOR RECONSIDERATION RECEIVED | Loading... |
| Mar 28, 2024 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Mar 28, 2024 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Feb 22, 2024 | GNFN | O | NOTIFICATION OF FINAL REFUSAL EMAILED | Loading... |
| Feb 22, 2024 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
| Feb 22, 2024 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... |
| Jan 6, 2024 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Jan 6, 2024 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Jan 6, 2024 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Oct 17, 2023 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Oct 17, 2023 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Oct 17, 2023 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Sep 18, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 11, 2023 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Dec 17, 2022 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 001
detergents for industrial use, namely, detergents for use in the manufacture of semiconductor; metal plating preparations, namely, chemicals for use in metal plating; Metal plating chemical compositions, namely, electrolytic acid copper solutions for use as semiconductor wiring materials; etching solutions for semiconductor manufacturing; fluorspar compounds used to make chemicals for semiconductor manufacturing
Classification
International Classes
001