Legal Representation
Attorney
Michael J. Medley
USPTO Deadlines
Application History
26 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Dec 30, 2024 | MAB6 | E | ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED | Loading... |
Dec 30, 2024 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
Jan 11, 2024 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
Jan 9, 2024 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
Jan 9, 2024 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
Jan 9, 2024 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Nov 28, 2023 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
Oct 3, 2023 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
Oct 3, 2023 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
Sep 13, 2023 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
Aug 29, 2023 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Aug 29, 2023 | CHAN | I | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED | Loading... |
Aug 29, 2023 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
Aug 29, 2023 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
Aug 28, 2023 | ALIE | A | ASSIGNED TO LIE | Loading... |
Apr 14, 2023 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
Mar 1, 2023 | EWAF | I | TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS | Loading... |
Mar 1, 2023 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
Mar 1, 2023 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
Mar 1, 2023 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
Jan 18, 2023 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
Jan 18, 2023 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
Jan 18, 2023 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
Jan 6, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Sep 13, 2022 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
Aug 27, 2022 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Machines and apparatus for the severing, production, alignment, adjustment, linking, coating, development, cleaning, printing, lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the severing, production, alignment, adjustment, linking, coating, development, cleaning, printing, lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular, transistors and wafers; installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, removal of oxides from surfaces, in particular through sputtering; installations and systems for etching semiconductor surfaces comprising plasma generating parts; installations for vaporising semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, apparatuses containing robot arms for wafer transport; installations for conveying, processing, and providing flat screens, namely, imprint apparatuses; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory and microcontroller chip manufacturing and memory and microcontroller chip assembly
Class 042
Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; Design and Development of Computer hardware and Software
Additional Information
Pseudo Mark
SMART CLEAVE
Classification
International Classes
007
042