Legal Representation
Attorney
John L Welch
USPTO Deadlines
Application History
14 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Feb 3, 2025 | RCSC | S | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED | Loading... |
Aug 5, 2024 | RCSC | S | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED | Loading... |
Feb 6, 2024 | RCSC | S | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED | Loading... |
Aug 8, 2023 | GNS3 | O | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED | Loading... |
Aug 8, 2023 | GNSL | S | LETTER OF SUSPENSION E-MAILED | Loading... |
Aug 8, 2023 | CNSL | R | SUSPENSION LETTER WRITTEN | Loading... |
Jul 10, 2023 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
Jul 10, 2023 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Jul 10, 2023 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
May 3, 2023 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
May 3, 2023 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
May 3, 2023 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
Apr 28, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Aug 3, 2022 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
Detailed Classifications
Class 009
solder bump deposition system and indium deposition system, namely, apparatus for depositing thin films of indium and solder bumps on semiconductor wafers and on glass
Classification
International Classes
009