Legal Representation
Attorney
Christopher M. Spletzer, Sr.
USPTO Deadlines
Next Deadline
158 days remaining
Statement of Use Due - Extension 5 Granted
Due Date
December 13, 2025
Application History
28 events| Date | Code | Type | Description |
|---|---|---|---|
| Jun 5, 2025 | EX5G | S | SOU EXTENSION 5 GRANTED |
| Jun 4, 2025 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
| Jun 3, 2025 | EXT5 | S | SOU EXTENSION 5 FILED |
| Jan 3, 2025 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Jan 3, 2025 | EX4G | S | SOU EXTENSION 4 GRANTED |
| Dec 30, 2024 | AITU | A | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| Nov 13, 2024 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
| Nov 13, 2024 | EXT4 | S | SOU EXTENSION 4 FILED |
| Jun 13, 2024 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Jun 3, 2024 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
| Jun 3, 2024 | EX3G | S | SOU EXTENSION 3 GRANTED |
| Jun 3, 2024 | EXT3 | S | SOU EXTENSION 3 FILED |
| Dec 14, 2023 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Dec 12, 2023 | EX2G | S | SOU EXTENSION 2 GRANTED |
| Dec 12, 2023 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
| Dec 12, 2023 | EXT2 | S | SOU EXTENSION 2 FILED |
| Jun 6, 2023 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Jun 2, 2023 | EX1G | S | SOU EXTENSION 1 GRANTED |
| Jun 2, 2023 | EXT1 | S | SOU EXTENSION 1 FILED |
| Jun 2, 2023 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
| Dec 13, 2022 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| Oct 18, 2022 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Oct 18, 2022 | PUBO | A | PUBLISHED FOR OPPOSITION |
| Sep 28, 2022 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Sep 13, 2022 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Sep 11, 2022 | DOCK | D | ASSIGNED TO EXAMINER |
| May 31, 2022 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| May 27, 2022 | NWAP | I | NEW APPLICATION ENTERED |
Detailed Classifications
Class 007
Machines for semiconductor processing and packaging, including semiconductor wafers; specifically wire bonding machines and machines for forming conductive structures on wafers using wire
Additional Information
Pseudo Mark
ULTRABUMP
Classification
International Classes
007