Legal Representation
Attorney
Simor L. Moskowitz
USPTO Deadlines
Next Deadline
1694 days remaining
Section 8 Declaration Due (Principal Register) (Based on registration date 20240903)
Due Date
September 03, 2030
Grace Period Ends
March 03, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
41 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jun 10, 2025 | NURC | C | NOTICE OF UPDATED REGISTRATION CONFIRMATION EMAILED | Loading... |
| May 22, 2025 | COC. | O | CORRECTION UNDER SECTION 7 - PROCESSED | Loading... |
| May 20, 2025 | NURC | C | NOTICE OF UPDATED REGISTRATION CONFIRMATION EMAILED | Loading... |
| Apr 25, 2025 | COC. | O | CORRECTION UNDER SECTION 7 - PROCESSED | Loading... |
| Apr 21, 2025 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Nov 29, 2024 | ES7R | I | TEAS SECTION 7 REQUEST RECEIVED | Loading... |
| Sep 3, 2024 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Sep 3, 2024 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Aug 1, 2024 | SUNA | E | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED | Loading... |
| Aug 1, 2024 | CNPR | P | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED | Loading... |
| Jun 15, 2024 | SUPC | I | STATEMENT OF USE PROCESSING COMPLETE | Loading... |
| May 13, 2024 | IUAF | S | USE AMENDMENT FILED | Loading... |
| Jun 15, 2024 | AITU | A | CASE ASSIGNED TO INTENT TO USE PARALEGAL | Loading... |
| May 13, 2024 | EISU | I | TEAS STATEMENT OF USE RECEIVED | Loading... |
| Feb 16, 2024 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
| Feb 15, 2024 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| Feb 15, 2024 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Feb 15, 2024 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Aug 29, 2023 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jul 4, 2023 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jul 4, 2023 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jun 14, 2023 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Jun 1, 2023 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| May 19, 2023 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| May 10, 2023 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| May 10, 2023 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| May 10, 2023 | GNEA | O | EXAMINERS AMENDMENT E-MAILED | Loading... |
| May 10, 2023 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| May 3, 2023 | ASGN | I | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | Loading... |
| Apr 21, 2023 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Apr 20, 2023 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Apr 20, 2023 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Oct 20, 2022 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Oct 20, 2022 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Oct 20, 2022 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Oct 13, 2022 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 20, 2022 | AMPX | O | PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED | Loading... |
| Jan 19, 2022 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Jan 12, 2022 | PARI | I | TEAS VOLUNTARY AMENDMENT RECEIVED | Loading... |
| Jan 14, 2022 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jan 11, 2022 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Semiconductor wafer processing machines; semiconductor wafer processing equipment; machines for manufacturing semiconductors; apparatus for manufacturing semiconductors, namely, semiconductor manufacturing machines; semiconductor manufacturing machines, namely, laser marking apparatus for manufacturing semiconductors; sputtering apparatus for application of films to semiconductors, being parts of machines for manufacturing and processing semiconductors; laser marking machines for marking semiconductor lead frames; semiconductor manufacturing machines, namely, silicon wafer cleaning equipment; semi-conductor substrates manufacturing machines; etching apparatus for use in manufacturing semiconductor substrates; manufacturing apparatus for substrates, namely, semiconductor substrates manufacturing machine; processing apparatus for substrates, namely, semiconductor substrates manufacturing machines; etching apparatus for use in manufacturing semiconductor wafers; semiconductor wafer processing equipment, namely, strip apparatus for semiconductor wafers; semiconductor wafer processing equipment, namely, ashing apparatus for semiconductor wafers
First Use Anywhere:
20000500
First Use in Commerce:
20000500
Additional Information
Other
In the statement, line 19, should be deleted, and FIRST USE 05/00/2000; USE IN COMMERCE 05/00/2000 should be inserted.
Classification
International Classes
007