VIA NEXT

Serial Number 97019499
Registration 7770337
700

Registration Progress

Application Filed
Sep 9, 2021
Under Examination
Aug 15, 2023
Approved for Publication
Jun 20, 2023
Published for Opposition
Jun 20, 2023
Registered
Apr 22, 2025

Trademark Image

VIA NEXT

Basic Information

Serial Number
97019499
Registration Number
7770337
Filing Date
September 9, 2021
Registration Date
April 22, 2025
Published for Opposition
June 20, 2023
Drawing Code
5

Status Summary

Current Status
Active
Status Code
700
Status Date
Apr 22, 2025
Registration
Registered
Classes
009 042

Rights Holder

VIA NEXT Technologies, Inc.

03
Address
10F, No. 533, Chung Cheng Road,
Xindian Dist.
New Taipei City 231
TW

Ownership History

VIA NEXT Technologies, Inc.

Original Applicant
03
New Taipei City TW

VIA NEXT Technologies, Inc.

Owner at Publication
03
New Taipei City TW

VIA NEXT Technologies, Inc.

Original Registrant
03
New Taipei City TW

Legal Representation

Attorney
Nicole B. Rackiewicz

USPTO Deadlines

Next Deadline
2101 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2025-04-22)
Due Date
April 22, 2031
Grace Period Ends
October 22, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.

Application History

43 events
Date Code Type Description Documents
Apr 22, 2025 NRCC E NOTICE OF REGISTRATION CONFIRMATION EMAILED Loading...
Apr 22, 2025 R.PR A REGISTERED-PRINCIPAL REGISTER Loading...
Apr 3, 2025 SUNA E NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED Loading...
Apr 3, 2025 CNPR P ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED Loading...
Apr 2, 2025 SUPC I STATEMENT OF USE PROCESSING COMPLETE Loading...
Apr 1, 2025 AITU A CASE ASSIGNED TO INTENT TO USE PARALEGAL Loading...
Jan 23, 2025 EISU I TEAS STATEMENT OF USE RECEIVED Loading...
Jan 23, 2025 IUAF S USE AMENDMENT FILED Loading...
Jul 17, 2024 EX2G S SOU EXTENSION 2 GRANTED Loading...
Jul 17, 2024 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Jul 17, 2024 EXT2 S SOU EXTENSION 2 FILED Loading...
Jul 17, 2024 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Jan 31, 2024 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Jan 29, 2024 EX1G S SOU EXTENSION 1 GRANTED Loading...
Jan 29, 2024 EXT1 S SOU EXTENSION 1 FILED Loading...
Jan 29, 2024 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Aug 15, 2023 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Jun 20, 2023 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Jun 20, 2023 PUBO A PUBLISHED FOR OPPOSITION Loading...
May 31, 2023 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
May 15, 2023 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
May 4, 2023 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
May 3, 2023 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
May 3, 2023 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Mar 2, 2023 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Mar 2, 2023 GNRT O NON-FINAL ACTION E-MAILED Loading...
Mar 2, 2023 CNRT R NON-FINAL ACTION WRITTEN Loading...
Mar 1, 2023 ZZZX Z PREVIOUS ALLOWANCE COUNT WITHDRAWN Loading...
Dec 27, 2022 PBCR Z WITHDRAWN FROM PUB - OG REVIEW QUERY Loading...
Dec 15, 2022 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Dec 14, 2022 XAEC I EXAMINER'S AMENDMENT ENTERED Loading...
Dec 14, 2022 GNEN O NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED Loading...
Dec 14, 2022 CNEA R EXAMINERS AMENDMENT -WRITTEN Loading...
Dec 14, 2022 GNEA O EXAMINERS AMENDMENT E-MAILED Loading...
Nov 8, 2022 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Nov 8, 2022 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Nov 8, 2022 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Jun 23, 2022 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Jun 23, 2022 GNRT F NON-FINAL ACTION E-MAILED Loading...
Jun 23, 2022 CNRT R NON-FINAL ACTION WRITTEN Loading...
Jun 14, 2022 DOCK D ASSIGNED TO EXAMINER Loading...
Oct 19, 2021 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Sep 13, 2021 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 009
electronic chips for the manufacture of integrated circuits; cards bearing integrated circuits; circuit boards provided with integrated circuits; integrated circuit chips for various applications, namely, encoding and decoding digital video; Dust protective masks; Circuit boards; Semi-conductors; Photomask substrates, namely, synthetic quartz glass plates being structural parts of excimer steppers, for use in fabrication of integrated circuits; Interface cards for data processing equipment in the form of printed circuits; Micro circuits; Integrated circuits; Electronic circuits; Printed circuit boards; Semiconductor chips; Electronic components in the nature of semiconductors; Integrated circuit sockets; Very large scale integration (VLSI) semiconductor integrated circuits; Silicon chips; silicon wafers; Main boards, namely, motherboards; Large scale integration (LSI) semiconductor integrated circuits; Semiconductor devices; microchips; Wafers for integrated circuits; Micro-processing chips containing electronic circuits for use in manipulating voltage; Downloadable computer software for use in database management; Central processing units (CPU); Microprocessors; Computer hardware, namely, central processing units (CPUs) with embedded operating system software
First Use Anywhere: Aug 5, 2021
First Use in Commerce: Sep 13, 2021
Class 042
Providing temporary use of on-line non-downloadable computer software for use in database management; Consulting services for the design, maintenance, testing and analysis of computer software systems and programs; providing information relating to computer technology and programming via a website; Consulting services for the design, testing and analysis of semiconductor chips; Consultation services for the design, testing and analysis of computer software system programs related to silicon intellectual property rights management
First Use Anywhere: Aug 5, 2021
First Use in Commerce: Sep 13, 2021

Additional Information

Design Mark
The mark consists of the words "VIA NEXT" in stylized font with the letter "A" formed by a substantially triangular shape interrupted at a bottom left hand portion.

Classification

International Classes
009 042