Legal Representation
Attorney
ROBERT V. JAMBOR
USPTO Deadlines
Application History
22 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Oct 18, 2023 | MAB3 | E | ABANDONMENT NOTICE MAILED - AFTER EX PARTE APPEAL | Loading... |
| Oct 18, 2023 | MAB3 | O | ABANDONMENT NOTICE MAILED - AFTER EX PARTE APPEAL | Loading... |
| Sep 12, 2023 | ABN3 | O | ABANDONMENT - AFTER EX PARTE APPEAL | Loading... |
| Sep 12, 2023 | EXPT | T | EXPARTE APPEAL TERMINATED | Loading... |
| Aug 22, 2023 | GNSN | O | NOTIFICATION OF EXAMINERS STATEMENT E-MAILED | Loading... |
| Aug 22, 2023 | GNES | O | EXAMINERS STATEMENT E-MAILED | Loading... |
| Aug 22, 2023 | CNES | R | EXAMINERS STATEMENT - COMPLETED | Loading... |
| Jun 23, 2023 | JURT | T | JURISDICTION RESTORED TO EXAMINING ATTORNEY | Loading... |
| Apr 24, 2023 | EXPI | T | EX PARTE APPEAL-INSTITUTED | Loading... |
| Apr 24, 2023 | EXAF | T | EXPARTE APPEAL RECEIVED AT TTAB | Loading... |
| Oct 24, 2022 | GNFN | O | NOTIFICATION OF FINAL REFUSAL EMAILED | Loading... |
| Oct 24, 2022 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
| Oct 24, 2022 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... |
| Sep 22, 2022 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Sep 21, 2022 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Sep 21, 2022 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Mar 22, 2022 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Mar 22, 2022 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Mar 22, 2022 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Mar 14, 2022 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Sep 8, 2021 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jun 26, 2021 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Grinding, polishing, lapping, sawing and wire slicing machines; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor wafers and substrates; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor silicon carbide
Class 035
Retail and online retail store services featuring silicon carbide
Class 040
Providing grinding, polishing, lapping, sawing and slicing services for semi-conductor wafers, substrates, and silicon carbide for others
Additional Information
Pseudo Mark
POWER SEMI
Classification
International Classes
007
035
040