Legal Representation
Attorney
Julie B. Albert
USPTO Deadlines
Application History
42 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Oct 11, 2022 | MAB6 | E | ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED | Loading... |
Oct 10, 2022 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
Jul 12, 2022 | EWAF | I | TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS | Loading... |
Jul 12, 2022 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
Jul 12, 2022 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
Jul 12, 2022 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
Mar 18, 2022 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
Mar 17, 2022 | EX3G | S | SOU EXTENSION 3 GRANTED | Loading... |
Mar 17, 2022 | AITU | A | CASE ASSIGNED TO INTENT TO USE PARALEGAL | Loading... |
Mar 7, 2022 | EXT3 | S | SOU EXTENSION 3 FILED | Loading... |
Mar 7, 2022 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Sep 9, 2021 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
Sep 7, 2021 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
Sep 7, 2021 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
Sep 7, 2021 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
May 12, 2021 | ASGN | I | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | Loading... |
Apr 13, 2021 | APET | A | ASSIGNED TO PETITION STAFF | Loading... |
Apr 13, 2021 | APET | A | ASSIGNED TO PETITION STAFF | Loading... |
Apr 13, 2021 | PCGR | O | PETITION TO DIRECTOR GRANTED | Loading... |
Mar 5, 2021 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED | Loading... |
Mar 3, 2021 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
Mar 3, 2021 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
Mar 3, 2021 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
Jan 26, 2021 | TPDR | I | TEAS PETITION TO DIRECTOR RECEIVED | Loading... |
Sep 8, 2020 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
Jul 14, 2020 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
Jul 14, 2020 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
Jun 24, 2020 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
Jun 8, 2020 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
May 28, 2020 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
May 28, 2020 | ALIE | A | ASSIGNED TO LIE | Loading... |
May 28, 2020 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
May 21, 2020 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
May 19, 2020 | ALIE | A | ASSIGNED TO LIE | Loading... |
May 19, 2020 | GEAP | F | EXAMINER'S AMENDMENT/PRIORITY ACTION E-MAILED | Loading... |
May 19, 2020 | GEAN | O | NOTIFICATION OF EXAMINER'S AMENDMENT/PRIORITY ACTION E-MAILED | Loading... |
May 19, 2020 | CPEA | R | EXAMINERS AMENDMENT AND/OR PRIORITY ACTION - COMPLETED | Loading... |
May 19, 2020 | CEPE | I | COMBINED EXAMINER'S AMENDMENT/PRIORITY ACTION ENTERED | Loading... |
May 11, 2020 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Feb 27, 2020 | MDSC | E | NOTICE OF DESIGN SEARCH CODE E-MAILED | Loading... |
Feb 26, 2020 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
Feb 25, 2020 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 001
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA), and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (CMP) slurry and chemical mechanical planarization (CMP) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
Class 003
Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
Class 007
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
Additional Information
Design Mark
The mark consists of a horizontal wavy line with a horizontal straight line bisecting the wavy line equally.
Color Claim
Color is not claimed as a feature of the mark.
Classification
International Classes
001
003
007