Serial Number 88806340
606

Registration Progress

Application Filed
Feb 21, 2020
Under Examination
Sep 8, 2020
Approved for Publication
Jul 14, 2020
Published for Opposition
Jul 14, 2020
Registered

Trademark Image

Basic Information

Serial Number
88806340
Filing Date
February 21, 2020
Published for Opposition
July 14, 2020
Abandonment Date
October 10, 2022
Drawing Code
2

Status Summary

Current Status
Inactive
Status Code
606
Status Date
Oct 10, 2022
Classes
001 003 007

Rights Holder

CMC MATERIALS, INC.

03
Address
870 NORTH COMMONS DRIVE
AURORA, IL 60504

Ownership History

Cabot Microelectronics Corporation

Original Applicant
03
Aurora, IL

Cabot Microelectronics Corporation

Owner at Publication
03
Aurora, IL

CMC MATERIALS, INC.

New Owner After Publication #1
03
AURORA, IL

Legal Representation

Attorney
Julie B. Albert

USPTO Deadlines

All Deadlines Cleared

All 2 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

42 events
Date Code Type Description Documents
Oct 11, 2022 MAB6 E ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED Loading...
Oct 10, 2022 ABN6 S ABANDONMENT - NO USE STATEMENT FILED Loading...
Jul 12, 2022 EWAF I TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS Loading...
Jul 12, 2022 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...
Jul 12, 2022 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Jul 12, 2022 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Loading...
Mar 18, 2022 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Mar 17, 2022 EX3G S SOU EXTENSION 3 GRANTED Loading...
Mar 17, 2022 AITU A CASE ASSIGNED TO INTENT TO USE PARALEGAL Loading...
Mar 7, 2022 EXT3 S SOU EXTENSION 3 FILED Loading...
Mar 7, 2022 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Sep 9, 2021 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Sep 7, 2021 EX2G S SOU EXTENSION 2 GRANTED Loading...
Sep 7, 2021 EXT2 S SOU EXTENSION 2 FILED Loading...
Sep 7, 2021 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
May 12, 2021 ASGN I AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Loading...
Apr 13, 2021 APET A ASSIGNED TO PETITION STAFF Loading...
Apr 13, 2021 APET A ASSIGNED TO PETITION STAFF Loading...
Apr 13, 2021 PCGR O PETITION TO DIRECTOR GRANTED Loading...
Mar 5, 2021 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Mar 3, 2021 EX1G S SOU EXTENSION 1 GRANTED Loading...
Mar 3, 2021 EXT1 S SOU EXTENSION 1 FILED Loading...
Mar 3, 2021 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Jan 26, 2021 TPDR I TEAS PETITION TO DIRECTOR RECEIVED Loading...
Sep 8, 2020 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Jul 14, 2020 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Jul 14, 2020 PUBO A PUBLISHED FOR OPPOSITION Loading...
Jun 24, 2020 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Jun 8, 2020 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
May 28, 2020 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
May 28, 2020 ALIE A ASSIGNED TO LIE Loading...
May 28, 2020 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
May 21, 2020 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
May 19, 2020 ALIE A ASSIGNED TO LIE Loading...
May 19, 2020 GEAP F EXAMINER'S AMENDMENT/PRIORITY ACTION E-MAILED Loading...
May 19, 2020 GEAN O NOTIFICATION OF EXAMINER'S AMENDMENT/PRIORITY ACTION E-MAILED Loading...
May 19, 2020 CPEA R EXAMINERS AMENDMENT AND/OR PRIORITY ACTION - COMPLETED Loading...
May 19, 2020 CEPE I COMBINED EXAMINER'S AMENDMENT/PRIORITY ACTION ENTERED Loading...
May 11, 2020 DOCK D ASSIGNED TO EXAMINER Loading...
Feb 27, 2020 MDSC E NOTICE OF DESIGN SEARCH CODE E-MAILED Loading...
Feb 26, 2020 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Feb 25, 2020 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 001
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA), and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (CMP) slurry and chemical mechanical planarization (CMP) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
Class 003
Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
Class 007
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry

Additional Information

Design Mark
The mark consists of a horizontal wavy line with a horizontal straight line bisecting the wavy line equally.
Color Claim
Color is not claimed as a feature of the mark.

Classification

International Classes
001 003 007