HIGH DENSITY VIA PATTERN (HDVP)

Serial Number 88771443
602

Registration Progress

Application Filed
Jan 23, 2020
Under Examination
Approved for Publication
Published for Opposition
Registered

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Mark: HIGH DENSITY VIA PATTERN (HDVP)
Previous Owner: TTM Technologies, Inc.
Classes: 009, 040

Trademark Image

HIGH DENSITY VIA PATTERN (HDVP)

Basic Information

Serial Number
88771443
Filing Date
January 23, 2020
Abandonment Date
October 20, 2021
Drawing Code
4000

Status Summary

Current Status
Inactive
Status Code
602
Status Date
Nov 1, 2021
Classes
009 040

Rights Holder

TTM Technologies, Inc.

03
Address
Suite 250
1665 Scenic Ave.
Costa Mesa, CA 92626

Ownership History

TTM Technologies, Inc.

Original Applicant
03
Costa Mesa, CA

Legal Representation

Attorney
Elton F. Dean, III

USPTO Deadlines

All Deadlines Cleared

All 1 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

17 events
Date Code Type Description Documents
Nov 1, 2021 MAB2 E ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND Loading...
Nov 1, 2021 MAB2 O ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND Loading...
Nov 1, 2021 ABN2 O ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE Loading...
Sep 14, 2021 DOCK D ASSIGNED TO EXAMINER Loading...
Apr 19, 2021 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Apr 19, 2021 GNRT O NON-FINAL ACTION E-MAILED Loading...
Apr 19, 2021 CNRT R NON-FINAL ACTION WRITTEN Loading...
Feb 5, 2021 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Feb 5, 2021 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Feb 3, 2021 ALIE A ASSIGNED TO LIE Loading...
Oct 28, 2020 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Apr 28, 2020 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Apr 28, 2020 GNRT F NON-FINAL ACTION E-MAILED Loading...
Apr 28, 2020 CNRT R NON-FINAL ACTION WRITTEN Loading...
Apr 11, 2020 DOCK D ASSIGNED TO EXAMINER Loading...
Jan 28, 2020 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Jan 27, 2020 NWAP I NEW APPLICATION ENTERED Loading...

Detailed Classifications

Class 009
Printed circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers
First Use Anywhere: 0
First Use in Commerce: 0
Class 040
Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others
First Use Anywhere: 0
First Use in Commerce: 0

Additional Information

Pseudo Mark
HIGH DENSITY VIA PATTERN (HIGH DENSITY VIA PATTERN)

Classification

International Classes
009 040