Legal Representation
Attorney
Mainak H. Mehta
USPTO Deadlines
Next Deadline
In Grace Period
Section 8 (6-Year) Declaration Due (Based on registration date 2019-04-09)
Due Date
April 09, 2025
Grace Period Ends
October 09, 2025
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
22 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Apr 3, 2025 | NA85 | E | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED | Loading... |
| Apr 3, 2025 | C15A | O | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. | Loading... |
| Apr 2, 2025 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Dec 16, 2024 | E815 | I | TEAS SECTION 8 & 15 RECEIVED | Loading... |
| Jun 28, 2024 | ASGN | I | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | Loading... |
| Apr 9, 2024 | REM1 | E | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED | Loading... |
| Apr 9, 2019 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Jan 22, 2019 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jan 22, 2019 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jan 2, 2019 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Dec 12, 2018 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Dec 12, 2018 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Dec 12, 2018 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Dec 10, 2018 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Dec 4, 2018 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Sep 12, 2018 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Sep 1, 2018 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED | Loading... |
| Sep 1, 2018 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Sep 1, 2018 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Sep 1, 2018 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| May 18, 2018 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| May 14, 2018 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
machines for bonding semiconductor chips; machines for bonding semiconductor chips to substrates; machines for manufacture, assembly, and processing of semiconductor devices and components; machines for the assembly of semiconductor components
Additional Information
Pseudo Mark
SILVER SAM
Classification
International Classes
007