Legal Representation
Attorney
Mr. Robert C. Faber
USPTO Deadlines
Next Deadline
1279 days remaining
Section 8 & 9 (10-Year) Renewal Due (Based on registration date 2019-01-15)
Due Date
January 15, 2029
Grace Period Ends
July 15, 2029
Application History
20 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jun 28, 2024 | ASGN | I | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | Loading... |
| Jan 15, 2024 | REM1 | E | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED | Loading... |
| Jan 15, 2019 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Oct 30, 2018 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Oct 30, 2018 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Oct 10, 2018 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Sep 13, 2018 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Aug 20, 2018 | OTHE | I | CASE RETURNED TO EXAMINATION | Loading... |
| Aug 20, 2018 | IUCN | S | NOTICE OF ALLOWANCE CANCELLED | Loading... |
| Aug 20, 2018 | PCBG | O | PETITION TO DIRECTOR - CHANGE BASIS - GRANTED | Loading... |
| Aug 14, 2018 | APET | A | ASSIGNED TO PETITION STAFF | Loading... |
| Jul 31, 2018 | TPAD | I | TEAS PETITION TO AMEND BASIS RECEIVED | Loading... |
| Jul 24, 2018 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| May 29, 2018 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| May 29, 2018 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| May 9, 2018 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Apr 22, 2018 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Apr 20, 2018 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 24, 2018 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jan 13, 2018 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Machines for the plasma processing of semiconductor components; Machines for the plasma processing of semiconductor wafers; Machines for the laser processing of semiconductor wafers; Robot controlled finishing machines
Additional Information
Pseudo Mark
DRY PLASMA
Classification
International Classes
007