Legal Representation
Attorney
Marie-Anne Mastrovito
USPTO Deadlines
Next Deadline
673 days remaining
Section 8 & 9 (10-Year) Renewal Due (Based on registration date 2017-09-12)
Due Date
September 12, 2027
Grace Period Ends
March 12, 2028
Application History
23 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Oct 11, 2023 | NA15 | E | SEC. 15 ACKNOWLEDGEMENT - E-MAILED | Loading... |
| Oct 11, 2023 | NAS8 | E | NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED | Loading... |
| Oct 11, 2023 | 15AK | O | REGISTERED - SEC. 15 ACKNOWLEDGED | Loading... |
| Oct 11, 2023 | 8.OK | O | REGISTERED - SEC. 8 (6-YR) ACCEPTED | Loading... |
| Oct 10, 2023 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Sep 12, 2023 | E15R | I | TEAS SECTION 15 RECEIVED | Loading... |
| Sep 12, 2023 | ES8R | I | TEAS SECTION 8 RECEIVED | Loading... |
| Sep 12, 2022 | REM1 | E | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED | Loading... |
| Sep 12, 2017 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Jun 27, 2017 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jun 27, 2017 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jun 7, 2017 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| May 22, 2017 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| May 22, 2017 | ALIE | A | ASSIGNED TO LIE | Loading... |
| May 10, 2017 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Apr 15, 2017 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Apr 15, 2017 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Apr 15, 2017 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Apr 15, 2017 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Apr 15, 2017 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Apr 13, 2017 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 25, 2017 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jan 21, 2017 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Chemical machines, namely, semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely, wire (( slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, )) sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers and machine parts therefor; (( Automatic distribution vending machines ))
First Use Anywhere:
20100400
First Use in Commerce:
20100400
Class 009
Precision measuring machines, namely, non-contact flatness measuring machines, laser interference length measuring sensors, optical fiber laser interferometer measuring machines, three-dimensional measuring machines, coordinate measuring machines; Data processing machines for use in processing coordinate measuring data; Computer controlled discrete device testers; Automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines and instruments, namely, electric current or voltage detectors, magnetic measuring apparatus in the nature of magnetic sensors, capacity measures; Optical instruments, namely, microscopes; (( Electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders ))
First Use Anywhere:
20100400
First Use in Commerce:
20100400
Classification
International Classes
007
009