TRANSCOMP

Serial Number 87123944
606

Registration Progress

Application Filed
Aug 2, 2016
Under Examination
Jun 21, 2017
Approved for Publication
Apr 25, 2017
Published for Opposition
Apr 25, 2017
Registered

Trademark Image

TRANSCOMP

Basic Information

Serial Number
87123944
Filing Date
August 2, 2016
Published for Opposition
April 25, 2017
Abandonment Date
July 22, 2019
Drawing Code
4000

Status Summary

Current Status
Inactive
Status Code
606
Status Date
Jul 22, 2019
Classes
007

Rights Holder

ASM Technology Singapore Pte Ltd

03
Address
2 Yishun Avenue 7
Singapore 768924
SG

Ownership History

ASM Technology Singapore Pte Ltd

Original Applicant
03
Singapore SG

ASM Technology Singapore Pte Ltd

Owner at Publication
03
Singapore SG

Legal Representation

Attorney
Robert C. Faber

USPTO Deadlines

All Deadlines Cleared

All 5 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

45 events
Date Code Type Description Documents
Jul 22, 2019 ABN6 S ABANDONMENT - NO USE STATEMENT FILED Loading...
Jul 22, 2019 MAB6 E ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED Loading...
Nov 20, 2018 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Nov 16, 2018 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Nov 16, 2018 EXT3 S SOU EXTENSION 3 FILED Loading...
Nov 16, 2018 EX3G S SOU EXTENSION 3 GRANTED Loading...
Sep 13, 2018 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Jun 20, 2018 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Jun 18, 2018 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Jun 18, 2018 EXT2 S SOU EXTENSION 2 FILED Loading...
Jun 18, 2018 EX2G S SOU EXTENSION 2 GRANTED Loading...
Oct 11, 2017 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Oct 9, 2017 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Oct 9, 2017 EXT1 S SOU EXTENSION 1 FILED Loading...
Oct 9, 2017 EX1G S SOU EXTENSION 1 GRANTED Loading...
Jun 21, 2017 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Apr 25, 2017 PUBO A PUBLISHED FOR OPPOSITION Loading...
Apr 25, 2017 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Apr 5, 2017 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Mar 17, 2017 PREV O LAW OFFICE PUBLICATION REVIEW COMPLETED Loading...
Mar 10, 2017 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Mar 9, 2017 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Mar 9, 2017 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Mar 8, 2017 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Feb 17, 2017 CNRT R NON-FINAL ACTION WRITTEN Loading...
Feb 17, 2017 GNRT O NON-FINAL ACTION E-MAILED Loading...
Feb 17, 2017 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
Jan 30, 2017 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Jan 30, 2017 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Jan 23, 2017 ERSI I TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED Loading...
Jan 23, 2017 ERSI I TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED Loading...
Nov 17, 2016 CNSL R SUSPENSION LETTER WRITTEN Loading...
Nov 17, 2016 GNSL S LETTER OF SUSPENSION E-MAILED Loading...
Nov 17, 2016 GNS3 O NOTIFICATION OF LETTER OF SUSPENSION E-MAILED Loading...
Nov 1, 2016 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Nov 1, 2016 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Oct 31, 2016 ALIE A ASSIGNED TO LIE Loading...
Oct 20, 2016 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Sep 21, 2016 CPRA R PRIORITY ACTION WRITTEN Loading...
Sep 21, 2016 GPRA F PRIORITY ACTION E-MAILED Loading...
Sep 21, 2016 GPRN O NOTIFICATION OF PRIORITY ACTION E-MAILED Loading...
Sep 14, 2016 DOCK D ASSIGNED TO EXAMINER Loading...
Aug 6, 2016 MPMK E NOTICE OF PSEUDO MARK E-MAILED Loading...
Aug 5, 2016 NWAP I NEW APPLICATION ENTERED Loading...
Aug 5, 2016 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...

Detailed Classifications

Class 007
Molding machines, namely, combined transfer molding and compression molding machines; molding machine parts, namely, molds for use in the manufacture of semiconductor devices, integrated circuit products, semiconductor wafers and semiconductor wafer-related products, panels and panel-related products for integrated circuits and semiconductor devices, light-emitting diodes, light-emitting diode products, and lead frames; transfer molding machines for use in the manufacture of semiconductor devices
First Use Anywhere: 0
First Use in Commerce: 0

Additional Information

Pseudo Mark
TRANS COMP

Classification

International Classes
007