MAXREL

Serial Number 86899372
601

Registration Progress

Application Filed
Feb 5, 2016
Under Examination
Approved for Publication
Published for Opposition
Registered

Trademark Image

MAXREL

Basic Information

Serial Number
86899372
Filing Date
February 5, 2016
Abandonment Date
November 21, 2016
Drawing Code
4000

Status Summary

Current Status
Inactive
Status Code
601
Status Date
Nov 22, 2016
Classes
001

Rights Holder

ALPHA ASSEMBLY SOLUTIONS INC.

03
Address
300 ATRIUM DRIVE, 3RD FLOOR
SOMERSET, NJ 08873

Ownership History

Alpha Metals, Inc.

Original Applicant
03
SOUTH PLAINFIELD, NJ

ALPHA ASSEMBLY SOLUTIONS INC.

New Owner Before Publication #1
03
SOMERSET, NJ

Legal Representation

Attorney
Midge M. Hyman

USPTO Deadlines

No Upcoming Deadlines

No upcoming deadlines found for this trademark.

Application History

11 events
Date Code Type Description
Nov 22, 2016 ABN1 O ABANDONMENT - EXPRESS MAILED
Nov 22, 2016 MAB1 O ABANDONMENT NOTICE MAILED - EXPRESS ABANDONMENT
Nov 21, 2016 EXAR I TEAS EXPRESS ABANDONMENT RECEIVED
Nov 16, 2016 ASGN I AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
May 23, 2016 DOCK D ASSIGNED TO EXAMINER
May 23, 2016 CNRT R NON-FINAL ACTION WRITTEN
May 23, 2016 GNRT F NON-FINAL ACTION E-MAILED
May 23, 2016 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED
Mar 30, 2016 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED
Feb 11, 2016 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Feb 9, 2016 NWAP I NEW APPLICATION ENTERED

Detailed Classifications

Class 001
Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal composite materials used in light emitting diode wafer bumping and used in hermetically sealing light emitting diode and organic light emitting diode products; electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics
First Use Anywhere: 0
First Use in Commerce: 0

Classification

International Classes
001