Legal Representation
Attorney
Midge M. Hyman
USPTO Deadlines
Application History
11 eventsDate | Code | Type | Description |
---|---|---|---|
Nov 22, 2016 | ABN1 | O | ABANDONMENT - EXPRESS MAILED |
Nov 22, 2016 | MAB1 | O | ABANDONMENT NOTICE MAILED - EXPRESS ABANDONMENT |
Nov 21, 2016 | EXAR | I | TEAS EXPRESS ABANDONMENT RECEIVED |
Nov 16, 2016 | ASGN | I | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
May 23, 2016 | DOCK | D | ASSIGNED TO EXAMINER |
May 23, 2016 | CNRT | R | NON-FINAL ACTION WRITTEN |
May 23, 2016 | GNRT | F | NON-FINAL ACTION E-MAILED |
May 23, 2016 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
Mar 30, 2016 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
Feb 11, 2016 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
Feb 9, 2016 | NWAP | I | NEW APPLICATION ENTERED |
Detailed Classifications
Class 001
Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal composite materials used in light emitting diode wafer bumping and used in hermetically sealing light emitting diode and organic light emitting diode products; electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
001