Integrated circuit chips; [ microwave generating devices for industrial use, namely, microwave integrated circuits; ] transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon carbide semiconductor wafers, [ radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, ] semiconductor devices in the nature of [ MMIC bare die, discrete broadband die, and ] discrete bare die; power transistor switching devices; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, and power modules

Customized materials assembly for others; [ manufacture of radio frequency in microwave devices and components, monolithic microwave integrated circuits (MMIC) bare die, discrete broadband die, ] discrete bare die for others; manufacture of transistors for others; [ manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; ] manufacturing services for others in the field of semiconductor devices; [ providing semiconductor material treatment information; ] technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices

Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems; design of [ radio frequency and microwave devices and components in the nature of monolithic microwave integrated circuits (MMIC) bare die, ] discrete broadband die [ , discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), and components formatted for the worldwide interoperability for microwave access standard ] ; packaging design [ ; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices ]