Legal Representation
Attorney
Mainak Mehta
USPTO Deadlines
Next Deadline
91 days remaining
Section 8 & 9 Renewal Due (Principal Register) (Based on registration date 20160322)
Due Date
March 22, 2026
Grace Period Ends
September 22, 2026
Application History
22 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Mar 22, 2025 | REM2 | E | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED | Loading... |
| Jun 13, 2022 | NA85 | E | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED | Loading... |
| Jun 13, 2022 | C15A | O | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. | Loading... |
| Jun 13, 2022 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Dec 24, 2021 | E815 | I | TEAS SECTION 8 & 15 RECEIVED | Loading... |
| Mar 22, 2021 | REM1 | E | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED | Loading... |
| Mar 22, 2016 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Jan 5, 2016 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jan 5, 2016 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Dec 16, 2015 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Dec 1, 2015 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| Nov 23, 2015 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Nov 21, 2015 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Nov 21, 2015 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 13, 2015 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Oct 23, 2015 | ERSI | I | TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED | Loading... |
| May 2, 2015 | GNS3 | O | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED | Loading... |
| May 2, 2015 | GNSL | F | LETTER OF SUSPENSION E-MAILED | Loading... |
| May 2, 2015 | CNSL | R | SUSPENSION LETTER WRITTEN | Loading... |
| Apr 30, 2015 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Feb 6, 2015 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jan 30, 2015 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Semiconductor wafer processing machines, Etching machines used for manufacturing semiconductor wafers, Ashing machines used for manufacturing semiconductor wafers, Cleaning machines used for manufacturing semiconductor wafers
Classification
International Classes
007