Legal Representation
Attorney
Bruce A. McDonald
USPTO Deadlines
Application History
22 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Oct 26, 2015 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
| Oct 26, 2015 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
| Sep 23, 2015 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Mar 24, 2015 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Jan 27, 2015 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jan 27, 2015 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jan 7, 2015 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Dec 19, 2014 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| Dec 17, 2014 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Dec 16, 2014 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Dec 15, 2014 | CPRA | R | PRIORITY ACTION WRITTEN | Loading... |
| Dec 15, 2014 | GPRA | F | PRIORITY ACTION E-MAILED | Loading... |
| Dec 15, 2014 | GPRN | O | NOTIFICATION OF PRIORITY ACTION E-MAILED | Loading... |
| Dec 15, 2014 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Dec 15, 2014 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Dec 11, 2014 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Sep 26, 2014 | AMPX | O | PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED | Loading... |
| Sep 22, 2014 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Sep 18, 2014 | PARI | I | TEAS VOLUNTARY AMENDMENT RECEIVED | Loading... |
| Sep 11, 2014 | MPMK | E | NOTICE OF PSEUDO MARK E-MAILED | Loading... |
| Sep 10, 2014 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Sep 1, 2014 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 041
Publishing and issuing scientific and technical papers in relation to scientific equipment used for plasma based cleaning, desmearing and etching, and plasma based deposition and metallization of substrates, circuit boards, semiconductors, computer chips, electronic devices and their interconnecting components
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Pseudo Mark
DEPOSI TECH
Classification
International Classes
041