Legal Representation
Attorney
Brian D. Thomas
USPTO Deadlines
Next Deadline
3148 days remaining
Section 8 & 9 Renewal Due (Principal Register) (Based on registration date 20140902)
Due Date
September 02, 2034
Grace Period Ends
March 02, 2035
Application History
20 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Nov 4, 2024 | NA89 | E | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED | Loading... |
| Nov 4, 2024 | RNL1 | Q | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) | Loading... |
| Nov 4, 2024 | 89AG | O | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED | Loading... |
| Nov 4, 2024 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Aug 8, 2024 | E89R | I | TEAS SECTION 8 & 9 RECEIVED | Loading... |
| Sep 2, 2023 | REM2 | E | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED | Loading... |
| Oct 26, 2019 | NA85 | E | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED | Loading... |
| Oct 26, 2019 | C15A | O | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. | Loading... |
| Oct 26, 2019 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Sep 13, 2019 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Sep 13, 2019 | E815 | I | TEAS SECTION 8 & 15 RECEIVED | Loading... |
| Sep 2, 2019 | REM1 | E | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED | Loading... |
| Sep 2, 2014 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Jun 17, 2014 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jun 17, 2014 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| May 28, 2014 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| May 13, 2014 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| May 12, 2014 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Feb 18, 2014 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Feb 8, 2014 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 007
Die bonders used in manufacturing electronic components; machines for mounting microchips, semiconductor chips, semiconductor components and electronic components; adhesive chemical dispensing machines; high precision dispense and assembly equipment for the semiconductor, advanced packaging and microelectronics industry; laser doping, laser scribing and laser disk texturing machines
First Use Anywhere:
Dec 31, 1987
First Use in Commerce:
Dec 31, 1987
Classification
International Classes
007