Legal Representation
Attorney
Nicole K. McLaughlin
USPTO Deadlines
Next Deadline
214 days remaining
Section 8 & 9 (10-Year) Renewal Due (Based on registration date 2016-02-09)
Due Date
February 09, 2026
Grace Period Ends
August 09, 2026
Application History
50 eventsDate | Code | Type | Description |
---|---|---|---|
Feb 9, 2025 | REM2 | E | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED |
Jun 27, 2022 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
Jun 27, 2022 | C15A | O | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
Jun 27, 2022 | NA85 | E | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED |
Jan 21, 2022 | E815 | I | TEAS SECTION 8 & 15 RECEIVED |
Jul 14, 2021 | CHAN | I | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED |
Jul 14, 2021 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
Jul 14, 2021 | ECDR | I | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS |
Jul 14, 2021 | EWAF | I | TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS |
Jul 14, 2021 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
Jul 14, 2021 | COAR | I | TEAS CHANGE OF OWNER ADDRESS RECEIVED |
Jul 14, 2021 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
Feb 9, 2021 | REM1 | E | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
Feb 9, 2016 | R.PR | A | REGISTERED-PRINCIPAL REGISTER |
Oct 30, 2015 | MPMK | E | NOTICE OF PSEUDO MARK E-MAILED |
Oct 29, 2015 | DP1B | I | 1(B) BASIS DELETED; PROCEED TO REGISTRATION |
Oct 29, 2015 | IUCN | S | NOTICE OF ALLOWANCE CANCELLED |
Oct 29, 2015 | DPCC | D | DIVISIONAL PROCESSING COMPLETE |
Jun 24, 2015 | ERTD | I | TEAS REQUEST TO DIVIDE RECEIVED |
Jun 24, 2015 | DRRR | I | DIVISIONAL REQUEST RECEIVED |
Jan 7, 2015 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
Jan 6, 2015 | EX3G | S | SOU EXTENSION 3 GRANTED |
Dec 24, 2014 | EXT3 | S | SOU EXTENSION 3 FILED |
Dec 24, 2014 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
Jul 25, 2014 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
Jul 24, 2014 | EX2G | S | SOU EXTENSION 2 GRANTED |
Jul 22, 2014 | AITU | A | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
Jun 25, 2014 | EXT2 | S | SOU EXTENSION 2 FILED |
Jun 25, 2014 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
Dec 25, 2013 | EXRA | E | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
Dec 23, 2013 | EX1G | S | SOU EXTENSION 1 GRANTED |
Dec 23, 2013 | EXT1 | S | SOU EXTENSION 1 FILED |
Dec 23, 2013 | EEXT | I | SOU TEAS EXTENSION RECEIVED |
Jun 25, 2013 | NOAM | E | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
Apr 30, 2013 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
Apr 30, 2013 | PUBO | A | PUBLISHED FOR OPPOSITION |
Apr 10, 2013 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
Mar 22, 2013 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED |
Mar 20, 2013 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER |
Mar 6, 2013 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE |
Mar 6, 2013 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED |
Feb 22, 2013 | ALIE | A | ASSIGNED TO LIE |
Feb 14, 2013 | ALIE | A | ASSIGNED TO LIE |
Feb 12, 2013 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
Feb 12, 2013 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
Aug 14, 2012 | GNRN | O | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
Aug 14, 2012 | CNRT | R | NON-FINAL ACTION WRITTEN |
Aug 14, 2012 | GNRT | O | NON-FINAL ACTION E-MAILED |
Jul 24, 2012 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED |
Jul 23, 2012 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE |
Detailed Classifications
Class 040
Semiconductor integrated circuit wafer fabrication services for others; custom fabrication of semiconductor integrated circuit wafers to customer's orders for others; semiconductor integrated circuit wafer etching services; cutting services, namely, cutting and processing of integrated circuits for commercial and non-commercial use; assembly of integrated circuits for others; making of integrated circuit photomasks to order for others; custom assembly of electronic chips and computer chips to order for customers; providing technical information on processing and manufacturing semiconductor integrated circuit wafers; assembly of electronic packaging of integrated circuits to the order and specification of customers; custom assembly of electronic packaging of integrated circuits, electronic chips and computer chips to the order and specification of customers
First Use Anywhere:
20061200
First Use in Commerce:
20061200
Class 042
Providing databases of information regarding design implementation and development of manufacturing (DFM) capabilities; providing databases of information to customers in the field of engineering process technology; providing services regarding semiconductor integrated circuit design, development and technology consultation via the Internet; providing information regarding semiconductor integrated circuit design and development to customer's order; providing consulting services for integrated circuit design; photomask design services for manufacturing semiconductors; providing design and development of computer programs in the fields of semiconductor chip processing equipment databases, integrated circuit design devices and manufacturing process technology; providing consultation for the design and development of computer programs in the fields of semiconductor chip processing equipment databases, integrated circuit design device and manufacturing process technology; providing an online computer database in the fields of semiconductor chip processing equipment, integrated circuit design devices and manufacturing process technology; design and maintenance of computer programs in the fields of semiconductor chip processing equipment databases, integrated circuit design devices and manufacturing process technology; research and development of technology and computer program designing and development in the fields of semiconductor chip processing equipment databases, integrated circuit design devices and manufacturing process technology; providing design services for others in the field of semiconductor integrated circuit wafers via global internet connection; providing an online, non-downloadable, Internet-based software application for designing manufacturing processes, devices and circuitry layout of integrated circuits; product testing of photomask materials used for manufacturing semiconductors and integrated circuits on electronic chips; testing, evaluation and analysis of electronic chips and computer chips to customer's orders for others for the purpose of certification
First Use Anywhere:
20061200
First Use in Commerce:
20061200
Additional Information
Color Claim
Color is not claimed as a feature of the mark.
Translation
The wording "GIGAFAB" has no meaning in a foreign language.
Pseudo Mark
GIGANTIC FABULOUS
Classification
International Classes
040
042