Legal Representation
Attorney
Midge M. Hyman
USPTO Deadlines
Application History
43 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Mar 7, 2016 | ABN6 | S | ABANDONMENT - NO USE STATEMENT FILED | Loading... |
| Mar 7, 2016 | MAB6 | O | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED | Loading... |
| Aug 6, 2015 | EXRA | O | NOTICE OF APPROVAL OF EXTENSION REQUEST MAILED | Loading... |
| Aug 5, 2015 | EX5G | S | SOU EXTENSION 5 GRANTED | Loading... |
| Aug 4, 2015 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Aug 4, 2015 | EXT5 | S | SOU EXTENSION 5 FILED | Loading... |
| Feb 7, 2015 | EXRA | O | NOTICE OF APPROVAL OF EXTENSION REQUEST MAILED | Loading... |
| Feb 6, 2015 | EX4G | S | SOU EXTENSION 4 GRANTED | Loading... |
| Feb 3, 2015 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Feb 3, 2015 | EXT4 | S | SOU EXTENSION 4 FILED | Loading... |
| Aug 7, 2014 | EXRA | O | NOTICE OF APPROVAL OF EXTENSION REQUEST MAILED | Loading... |
| Aug 6, 2014 | EX3G | S | SOU EXTENSION 3 GRANTED | Loading... |
| Aug 4, 2014 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Aug 4, 2014 | EXT3 | S | SOU EXTENSION 3 FILED | Loading... |
| Feb 25, 2014 | EXRA | O | NOTICE OF APPROVAL OF EXTENSION REQUEST MAILED | Loading... |
| Feb 24, 2014 | AITU | A | CASE ASSIGNED TO INTENT TO USE PARALEGAL | Loading... |
| Feb 24, 2014 | EX2G | S | SOU EXTENSION 2 GRANTED | Loading... |
| Feb 4, 2014 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Feb 4, 2014 | EXT2 | S | SOU EXTENSION 2 FILED | Loading... |
| Aug 2, 2013 | EXRA | O | NOTICE OF APPROVAL OF EXTENSION REQUEST MAILED | Loading... |
| Jul 31, 2013 | EEXT | I | SOU TEAS EXTENSION RECEIVED | Loading... |
| Jul 31, 2013 | EXT1 | S | SOU EXTENSION 1 FILED | Loading... |
| Jul 31, 2013 | EX1G | S | SOU EXTENSION 1 GRANTED | Loading... |
| May 22, 2013 | ASGN | I | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | Loading... |
| Feb 5, 2013 | NOAM | O | NOA MAILED - SOU REQUIRED FROM APPLICANT | Loading... |
| Dec 11, 2012 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Nov 21, 2012 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Nov 7, 2012 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Nov 7, 2012 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| Oct 24, 2012 | CNSA | P | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Sep 19, 2012 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Sep 19, 2012 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Sep 19, 2012 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Mar 28, 2012 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Mar 28, 2012 | CNRT | O | NON-FINAL ACTION MAILED | Loading... |
| Mar 8, 2012 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Mar 7, 2012 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Mar 7, 2012 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Sep 9, 2011 | CNRT | F | NON-FINAL ACTION MAILED | Loading... |
| Sep 8, 2011 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Aug 25, 2011 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| May 17, 2011 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| May 14, 2011 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 001
Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal composite materials used in light emitting diode wafer bumping and used in hermetically sealing light emitting diode and organic light emitting diode products; electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics
First Use Anywhere:
0
First Use in Commerce:
0
Class 006
Lead free and tin-lead solder pastes, solder wire, solder preforms made of metal, wave metal solder bar made from such alloys
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
001
006