LIQUI-PAD

Serial Number 85242483
606

Registration Progress

Application Filed
Feb 15, 2011
Under Examination
Oct 30, 2012
Approved for Publication
Sep 4, 2012
Published for Opposition
Sep 4, 2012
Registered

Trademark Image

LIQUI-PAD

Basic Information

Serial Number
85242483
Filing Date
February 15, 2011
Published for Opposition
September 4, 2012
Abandonment Date
June 1, 2015
Drawing Code
4000

Status Summary

Current Status
Inactive
Status Code
606
Status Date
Jun 1, 2015
Classes
001

Rights Holder

HENKEL IP & HOLDING GMBH

16
Address
HENKELSTRASSE 67
DUESSELDORF 40589
DE

Ownership History

The Bergquist Company

Original Applicant
03
Chanhassen, MN

The Bergquist Company

Owner at Publication
03
Chanhassen, MN

HENKEL AG & CO. KGAA

New Owner After Publication #1
99
DUESSELDORF DE

HENKEL IP & HOLDING GMBH

New Owner After Publication #2
16
DUESSELDORF DE

Legal Representation

Attorney
Eric O. Haugen

USPTO Deadlines

All Deadlines Cleared

All 6 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

44 events
Date Code Type Description Documents
Nov 2, 2016 ASGN I AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Loading...
Oct 21, 2015 ASGN I AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Loading...
Jun 1, 2015 ABN6 S ABANDONMENT - NO USE STATEMENT FILED Loading...
Jun 1, 2015 MAB6 O ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED Loading...
Sep 17, 2014 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Sep 16, 2014 EX4G S SOU EXTENSION 4 GRANTED Loading...
Aug 28, 2014 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Aug 28, 2014 EXT4 S SOU EXTENSION 4 FILED Loading...
Mar 19, 2014 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Mar 18, 2014 EX3G S SOU EXTENSION 3 GRANTED Loading...
Mar 4, 2014 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Mar 4, 2014 EXT3 S SOU EXTENSION 3 FILED Loading...
Dec 24, 2013 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Dec 21, 2013 EX2G S SOU EXTENSION 2 GRANTED Loading...
Dec 7, 2013 AITU A CASE ASSIGNED TO INTENT TO USE PARALEGAL Loading...
Oct 30, 2013 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Oct 30, 2013 EXT2 S SOU EXTENSION 2 FILED Loading...
Apr 24, 2013 EXRA E NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Loading...
Apr 22, 2013 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Apr 22, 2013 EXT1 S SOU EXTENSION 1 FILED Loading...
Apr 22, 2013 EX1G S SOU EXTENSION 1 GRANTED Loading...
Oct 30, 2012 NOAM E NOA E-MAILED - SOU REQUIRED FROM APPLICANT Loading...
Sep 4, 2012 PUBO A PUBLISHED FOR OPPOSITION Loading...
Sep 4, 2012 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Aug 15, 2012 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Jul 27, 2012 PREV O LAW OFFICE PUBLICATION REVIEW COMPLETED Loading...
Jul 26, 2012 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Jul 26, 2012 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Jul 26, 2012 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Jul 3, 2012 ERFR I TEAS REQUEST FOR RECONSIDERATION RECEIVED Loading...
Jan 4, 2012 CNFR R FINAL REFUSAL WRITTEN Loading...
Jan 4, 2012 GNFR O FINAL REFUSAL E-MAILED Loading...
Jan 4, 2012 GNFN O NOTIFICATION OF FINAL REFUSAL EMAILED Loading...
Dec 8, 2011 ALIE A ASSIGNED TO LIE Loading...
Dec 8, 2011 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Dec 8, 2011 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Nov 22, 2011 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
May 24, 2011 CNRT R NON-FINAL ACTION WRITTEN Loading...
May 24, 2011 GNRT F NON-FINAL ACTION E-MAILED Loading...
May 24, 2011 GNRN O NOTIFICATION OF NON-FINAL ACTION E-MAILED Loading...
May 17, 2011 DOCK D ASSIGNED TO EXAMINER Loading...
Feb 19, 2011 MPMK O NOTICE OF PSEUDO MARK MAILED Loading...
Feb 18, 2011 NWAP I NEW APPLICATION ENTERED Loading...
Feb 18, 2011 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...

Detailed Classifications

Class 001
Electrically insulative, thermally conductive chemical interface compounds for mounting electronic devices onto computer chassis, computer heat sinks, heat sinks for use in electronic components, or printed circuitry boards
First Use Anywhere: 0
First Use in Commerce: 0

Additional Information

Pseudo Mark
LIQUID PAD

Classification

International Classes
001