MLCMC

Serial Number 79411254
681

Registration Progress

Application Filed
Sep 11, 2024
Under Examination
Approved for Publication
Published for Opposition
Aug 5, 2025
Registered

Trademark Image

MLCMC

Basic Information

Serial Number
79411254
Filing Date
September 11, 2024
Published for Opposition
August 5, 2025
Drawing Code
4

Status Summary

Current Status
Active
Status Code
681
Status Date
Jul 17, 2025
Application
Pending
Classes
006 009

Rights Holder

A.L.M.T. Corp.

03
Address
8-21-1, Ginza,
Chuo-ku Tokyo 104-0061
JP

Ownership History

A.L.M.T. Corp.

Original Applicant
03
JP

Legal Representation

Attorney
Jerald E. Nagae, Reg. No. 29,418

USPTO Deadlines

All Deadlines Cleared

All 1 deadline(s) have been cleared by subsequent events. No active deadlines at this time.

Application History

14 events
Date Code Type Description Documents
Jul 30, 2025 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
Jul 1, 2025 CNSA O APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Jun 18, 2025 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Jun 18, 2025 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Jun 18, 2025 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
May 17, 2025 RFNT P REFUSAL PROCESSED BY IB Loading...
Apr 29, 2025 RFCS P NON-FINAL ACTION MAILED - REFUSAL SENT TO IB Loading...
Apr 29, 2025 RFRR P REFUSAL PROCESSED BY MPU Loading...
Mar 18, 2025 RFCR E NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW Loading...
Mar 17, 2025 CNRT R NON-FINAL ACTION WRITTEN Loading...
Mar 12, 2025 DOCK D ASSIGNED TO EXAMINER Loading...
Dec 6, 2024 MAFR O APPLICATION FILING RECEIPT MAILED Loading...
Dec 6, 2024 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Dec 5, 2024 REPR M SN ASSIGNED FOR SECT 66A APPL FROM IB Loading...

Detailed Classifications

Class 006
Composite metals composed of copper and molybdenum; nonferrous metals and their alloys.
Class 009
Heat radiation components in the nature of heat sinks for use in semiconductor devices made of composite materials composed of copper and molybdenum; heat spreaders being heat sinks for use in semiconductor devices made of composite materials composed of copper and molybdenum; heat radiation components in the nature of heat sinks for use in semiconductor devices; heat spreaders being heat sinks for use in semiconductor devices; voltage regulators; electrical control apparatus and instruments, namely, electrical controllers, electric control panels, electric current control devices; power distribution and control machines and apparatus, namely, electrical controllers, electric current control devices, power switches.

Classification

International Classes
006 009