Legal Representation
Attorney
Sandra Epp Ryan
USPTO Deadlines
Next Deadline
50 days remaining
Final Refusal E-Mailed
Due Date
September 04, 2025
Extension Available
Until December 04, 2025
Application History
20 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Jun 4, 2025 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
Jun 4, 2025 | GNFN | O | NOTIFICATION OF FINAL REFUSAL EMAILED | Loading... |
Jun 4, 2025 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... |
Apr 25, 2025 | AMPX | O | PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED | Loading... |
Apr 25, 2025 | PARI | I | TEAS VOLUNTARY AMENDMENT RECEIVED | Loading... |
Mar 19, 2025 | CREV | I | CORRECTION FROM IB ENTERED - ATTORNEY REVIEW REQUIRED | Loading... |
Mar 1, 2025 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
Feb 27, 2025 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
Feb 27, 2025 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Sep 21, 2024 | RFNT | P | REFUSAL PROCESSED BY IB | Loading... |
Sep 2, 2024 | RFCS | P | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | Loading... |
Sep 2, 2024 | RFRR | P | REFUSAL PROCESSED BY MPU | Loading... |
Aug 31, 2024 | CRCV | M | CORRECTION TRANSACTION RECEIVED FROM IB | Loading... |
Aug 31, 2024 | RFCR | E | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | Loading... |
Aug 30, 2024 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
Aug 29, 2024 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
Jun 28, 2024 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
Jun 28, 2024 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
Jun 25, 2024 | LIMI | I | LIMITATION FROM ORIGINAL APPLICATION ENTERED | Loading... |
Jun 13, 2024 | REPR | M | SN ASSIGNED FOR SECT 66A APPL FROM IB | Loading... |
Detailed Classifications
Class 007
Semiconductor manufacturing machines and parts therefor; semiconductor manufacturing machines with a testing unit sold as an integral component; molds being parts of machines for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts therefor; resin sealing machines for manufacturing semiconductors with a testing unit sold as an integral component; cutting machines for manufacturing semiconductors and parts therefor; cutting machines for manufacturing semiconductors with a testing unit sold as an integral component; integrated circuits manufacturing machines and parts therefor; integrated circuits manufacturing machines with a testing unit sold as an integral component; electronic circuits manufacturing machines and parts therefor; electronic circuits manufacturing machines with a testing unit sold as an integral component; circuit boards manufacturing machines and parts therefor; circuit boards manufacturing machines with a testing unit sold as an integral component; printed wiring boards manufacturing machines and parts therefor; printed wiring boards manufacturing machines with a testing unit sold as an integral component; electronic parts manufacturing machines and parts therefor; resin sealing machines for integrated circuits and parts therefor; resin sealing machines for electronic circuits and parts therefor; resin sealing machines for circuit boards and parts therefor; resin sealing machines for printed wiring boards and parts therefor; resin sealing machines for electronic parts and parts therefor; molds being parts of machines for sealing resins of integrated circuits and parts therefor; molds being parts of machines for sealing resins of electronic circuits and parts therefor; molds being parts of machines for sealing resins of circuit boards and parts therefor; molds being parts of machines for sealing resins of printed wiring boards and parts therefor; molds being parts of machines for sealing resins of electronic parts and parts therefor; cutting machines for manufacturing integrated circuits and parts therefor; cutting machines for manufacturing electronic circuits and parts therefor; cutting machines for manufacturing circuit boards and parts therefor; cutting machines for manufacturing printed wiring boards and parts therefor; cutting machines for manufacturing electronic parts and parts therefor; plastic processing machines and apparatus and parts therefor; molds being parts of machines for processing resins; molds being parts of machines for processing plastics; metalworking machines and parts therefor; molds and press dies being parts of machines for metal-forming; cutting tools for machinery; ceramic processing machines and parts therefor; ceramic cutting machines and parts therefor; glass processing machines and parts therefor; machines and apparatus for manufacturing rubber goods; laser cutting machines for manufacturing semiconductors; laser trimming machines for manufacturing semiconductors; laser cutting machines for processing plastics; laser trimming machines for processing plastics; laser cutting machines for manufacturing electronic parts; laser trimming machines for manufacturing electronic parts; laser cutting machines for metalworking; laser trimming machines for metalworking; laser cutting machines for processing ceramics; laser trimming machines for processing ceramics; laser cutting machines for processing glass; laser trimming machines for processing glass; laser cutting machines for processing rubber; laser trimming machines for processing rubber; laser marking apparatus, namely, laser marking machines to mark surfaces by oxidation, etching, engraving, foaming, chemical change, or carbonization; laser engraving apparatus for manufacturing semiconductors; electric laser welding machines; finishing machines for metalworking, woodworking and plastics working; cutting machines and parts therefor; metal cutting machines; resin cutting machines; plastic cutting machines; glass cutting machines; paper cutting machines; glass-resin cutting machines; metal-resin cutting machines; semiconductor-resin cutting machines; blades being parts of cutting machines; blades being parts of semiconductor manufacturing machines; blades being parts of electronic parts manufacturing machines; blades being parts of metal cutting machines; blades being parts of resin cutting machines; blades being parts of plastic cutting machines; blades being parts of ceramic cutting machines; automobile parts manufacturing machines; machines for manufacturing pharmaceuticals and parts therefor; industrial machine presses; cemented carbide cutting tools; moulds being parts of machines for use in the manufacture of rubber goods; industrial machine press for correcting distortion of frames of semiconductor substrates; laser cutting machines
Class 009
Computer peripheral devices; personal digital assistants; projectors for stereoscopic images; optical lenses; lenses for spectacles
Class 017
Plastic films for use in mold release during manufacture process of semiconductors, integrated circuits, electronic circuits, circuit boards, printed wiring boards and electronic parts; plastic substances, semi-processed
Class 037
Repair or maintenance of semiconductor manufacturing machines; repair or maintenance of resin sealing machines for manufacturing semiconductors; repair or maintenance of cutting machines for manufacturing semiconductors; repair or maintenance of electronic parts manufacturing machines; repair or maintenance of resin sealing machines for electronic parts; repair or maintenance of cutting machines for manufacturing electronic parts; repair or maintenance of plastic processing machines and apparatus; repair or maintenance of metalworking machines; repair or maintenance of ceramic processing machines and apparatus; repair or maintenance of glass processing machines and apparatus; repair or maintenance of machines and apparatus for manufacturing rubber goods; repair or maintenance of apparatus for testing semiconductor, printed circuit boards or electronic parts; repair or maintenance of molds.
Class 040
Processing of ceramics; custom molding and shaping of plastic products for others; custom molding and shaping of synthetic resins for others; processing of plastics; encapsulation of semiconductors; custom manufacture and processing of semiconductors; custom assembling and precise processing of electronic parts; metalworking; custom manufacture and processing of lenses; custom manufacture and processing of optical lenses; processing of glass; custom manufacturing of medical apparatus and instruments for others; PVD (Physical Vapor Deposition) coating and wet process coating services for the appliation of coatings to medical apparatus and instruments; application of coatings by ceramics, namely, ceramic PVD (Physical Vapor Deposition) coating and ceramic wet process coating services; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to semiconductor manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to electronic parts manufacturing machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to plastic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to cutting tools for machinery; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to metal surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to metalworking machines; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to ceramic processing machines and apparatus; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass surfaces; PVD (Physical Vapor Deposition) coating and wet process coating services for the application of coatings to glass processing machines and apparatus; metal plating of molds; custom manufacturing of synthetic resin-forming molds.
Class 042
Rental of computers; monitoring of computer systems to detect breakdowns; computer programming; technological advice relating to computers, automobiles and industrial machines
Additional Information
Design Mark
The mark consists of a stylized bird with outstretched wings in a circle.
Classification
International Classes
007
009
017
037
040
042