Legal Representation
Attorney
SUSAN S JACKSON
USPTO Deadlines
Next Deadline
1945 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2025-03-04)
Due Date
March 04, 2031
Grace Period Ends
September 04, 2031
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
45 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Oct 3, 2025 | FINO | P | FINAL DECISION TRANSACTION PROCESSED BY IB | Loading... |
| Sep 15, 2025 | FICS | P | FINAL DISPOSITION NOTICE SENT TO IB | Loading... |
| Sep 15, 2025 | FIMP | P | FINAL DISPOSITION PROCESSED | Loading... |
| Jun 4, 2025 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... |
| Mar 4, 2025 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Mar 4, 2025 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Jan 14, 2025 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Jan 14, 2025 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Jan 8, 2025 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Dec 16, 2024 | EXPT | T | EXPARTE APPEAL TERMINATED | Loading... |
| Dec 16, 2024 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Dec 16, 2024 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Dec 16, 2024 | GNEA | F | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Dec 16, 2024 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Dec 16, 2024 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Dec 9, 2024 | JURT | T | JURISDICTION RESTORED TO EXAMINING ATTORNEY | Loading... |
| Dec 9, 2024 | EXPI | T | EX PARTE APPEAL-INSTITUTED | Loading... |
| Dec 9, 2024 | EXAF | T | EXPARTE APPEAL RECEIVED AT TTAB | Loading... |
| Dec 9, 2024 | ERFR | I | TEAS REQUEST FOR RECONSIDERATION RECEIVED | Loading... |
| Dec 9, 2024 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Dec 9, 2024 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 9, 2024 | OPNX | P | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB | Loading... |
| Oct 23, 2024 | OPNS | P | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | Loading... |
| Oct 23, 2024 | OPNR | P | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB | Loading... |
| Oct 11, 2024 | NREP | P | NEW REPRESENTATIVE AT IB RECEIVED | Loading... |
| Jun 12, 2024 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
| Jun 12, 2024 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... |
| Jun 12, 2024 | GNFN | O | NOTIFICATION OF FINAL REFUSAL EMAILED | Loading... |
| May 9, 2024 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| May 9, 2024 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| May 9, 2024 | COAR | I | TEAS CHANGE OF OWNER ADDRESS RECEIVED | Loading... |
| May 9, 2024 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
| May 9, 2024 | CHAN | I | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED | Loading... |
| May 9, 2024 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
| May 9, 2024 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| May 9, 2024 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 28, 2023 | RFNP | P | REFUSAL PROCESSED BY IB | Loading... |
| Nov 9, 2023 | RFCS | P | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | Loading... |
| Nov 9, 2023 | RFRR | P | REFUSAL PROCESSED BY MPU | Loading... |
| Nov 4, 2023 | RFCR | E | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | Loading... |
| Nov 3, 2023 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Oct 20, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jun 6, 2023 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
| May 31, 2023 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| May 25, 2023 | REPR | M | SN ASSIGNED FOR SECT 66A APPL FROM IB | Loading... |
Detailed Classifications
Class 007
Machines for use in industry for the manufacture of integrated circuits, semiconductors and electronics; controlled atmosphere machines and installations for manufacturing integrated circuits, semiconductors and electronics; machine systems comprised of industrial machines for the automated production of integrated circuits, semiconductors and electronics; structural parts, structural fittings and structural accessories for all of the aforesaid goods
Class 009
Semiconductor components, namely, diodes, transistors, optoelectronics, resistors, thyristors, capacitors, fuses, thermistors, heatsinks, thermal interface materials, inductors, oscillators, sensors, transducers, switches, relays, solenoids, interposers, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies comprised of insulating materials, electronic components, interconnections; computer components, namely, central processing units, motherboards, random access memory modules, read-only memory modules, video graphic array ports, power suppliers, cooling fans, hard drives, graphics cards, sound cards, memory expansion cards; electronic components, namely, diodes, transistors, optoelectronics, resistors, thyristors, capacitors, fuses, thermistors, heatsinks, thermal interface materials, inductors, oscillators, sensors, transducers, switches, relays, solenoids, interposers; electric apparatus, namely, microprocessors, memory chips in the nature of integrated circuits, power transistors, light-emitting diodes, photovoltaic cells, charge-coupled devices, complementary metal-oxide semiconductors, radio frequency amplifiers, field effect transistors, analog to digital converter (ADCs), digital to analog converters (DACs), micromechanical systems (MEMS) comprised of microsensors, microprocessors, microactuators, units for data processing, voltage regulators, radio frequency identification (RFID) tags, voltage-controlled oscillators (VCOs), electric sensors; communications equipment, namely, electronic sensors, electric actuators, infotainment systems comprised of GPS and wireless interconnection modules, electric switches, wireless routers, telecommunications base stations, amplifiers, modems, multiplexers, programmable logic controllers, smartphone, laptops, tablet computers, digital cameras, smartwatches, inverters, electric power converters, oscilloscopes, spectrum analyzers for the generation, measurement and analysis of audio signals in the nature of audio analyzers, signal generators, digital multimeters; transparent electronic circuits; wearable electronic circuits; ultra-thin electronic circuits; integrated circuits; semiconductors; electronics for displays, namely, electronic display boards, plasma display boards, electronic display screens; electronic tags for goods; smart labels in the nature of electronic tags for goods; blank smart cards; telecommunication devices, namely, teleconferencing systems comprised of computer hardware, telephones and downloadable software for teleconferencing; modems; network routers; telephone call routers; radios; transponders; audio-video receivers; cellular telephones; smartphones; tablet computers; laptops; computers; computer hardware, namely wireless Access points (WAPs); digital television; Radio frequency identification (RFID) tags, RFID readers, Blank near field communication (NFC) labels and tags, computer memory devices, electric sensors, optical sensors, touchscreen sensors; computer screen filters; computer game cartridges; thermometers other than for medical use; product authentication devices, namely, Radio frequency identification (RFID) tags, Near field communication (NFC) tags, Radio frequency identification (RFID) readers, Near field communication (NFC) technology-enabled readers, smart encoded bar code labels, secure authentication microchips, smart packaging comprised of encoded electronic chips, blank electronic secure storage media, secure encoded electronic tokens for product authentication and secure encoded electronic cards for product authentication; secure authentication tokens and secure authentication cards; downloadable computer programs for controlling and monitoring installations, systems and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable computer programs for controlling and monitoring processes for manufacturing integrated circuits, semiconductors and electronics; electric installations for the remote control of industrial operations; downloadable brochures and instruction manuals for computer controlled and monitored systems, installations and machinery for the manufacture of integrated circuits, semiconductors and electronics; downloadable brochures, datasheets, instruction manuals and semiconductor component layouts for computer controlled and monitored systems, installations and machinery for the manufacture of integrated circuits, semiconductors and electronics; structural parts and fittings for systems, installations and machinery for the manufacture of integrated circuits, semiconductors and electronics; accessories for computer controlled and monitored systems, installations and machinery for the manufacture of integrated circuits; semiconductors and electronics, namely, semiconductor wafer carriers and cassettes, dispensers for measuring and dispensing chemicals, semiconductor wafer ID readers, chillers and thermal control units being temperature controllers for controlling temperature of equipment during the manufacturing process, particle counters for measuring and monitoring air quality, RFID asset tracking systems comprised of RFID tags, labels chips, readers and writers, process residual gas analysers, semiconductor wafer barcode and RFID labels; semiconductor devices; wafers for integrated circuits; flexible electronic circuits; downloadable data files, text files, image files, instruction manuals, documents, brochures and datasheets, all for use in the design of semiconductors, integrated circuits, electronics, namely, diodes, transistors, optoelectronics, resistors, thyristors, capacitors, fuses, thermistors, heatsinks, thermal interface materials, inductors, oscillators, sensors, transducers, switches, relays, solenoids, interposers, central processing units, motherboards, random access memory modules, read-only memory modules, video graphic array ports, power suppliers, cooling fans, hard drives, graphics cards, sound cards, expansion cards, microprocessors, memory chips, power transistors, light-emitting diodes, photovoltaic cells, charge-coupled devices, complementary metal-oxide semiconductors, radio frequency amplifiers, field effect transistors, analog to digital converter (ADCs), digital to analog converters (DACs), micromechanical systems (MEMS), voltage regulators, radio frequency identification (RFID) tags, voltage-controlled oscillators (VCOs), sensors, sensors, actuators, infotainment systems comprised of GPS and wireless interconnection modules, switches, routers, base stations, amplifiers, modems, multiplexers, programmable logic controllers, smartphone, laptops, tablets, digital cameras, smartwatches, home entertainments systems, inverters, battery management systems (BMS), power converters, oscilloscopes, spectrum analyzers, signal generators, multimeters, data acquisition systems, security systems and flexible electronic circuits; biochips for research or scientific purposes; encoded key cards; microprocessors; printed circuit board assemblies; electric resistors; transistors; receivers and transmitters for communicating with RFID devices and chips; apparatus, instruments and equipment for near field communications (NFC), namely NFC tags for making mobile payments and providing advertising information, NFC readers, downloadable software for use as an NFC tag, chip and label writer, NFC antennas, NFC memory modules, NFC-enabled wearables in the nature of smart watches, activity tracker wristbands, fitness activity trackers, activity tracker rings, activity tracker bracelets, NFC labels for making mobile payments and providing advertising information, Blank NFC labels, Blank NFC tags.
Class 040
Semiconductor fabrication services for others; custom manufacture of semiconductors, semiconductor devices, semiconductor chips, wafers, integrated circuits, electronics and flexible electronic circuits; custom manufacture and assembly of semiconductors, integrated circuits and electronics for others; foundry services in relation to the custom manufacture and assembly of integrated circuits, semiconductors and electronics for others; advisory and consultancy services relating to the aforesaid
Class 042
Scientific and technological research and design in the fields of integrated circuits, semiconductors and electronics; custom design of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components, electronic components, of apparatus and equipment using such circuits and components, and of machines and systems for the manufacture of such circuits and components; design and development of hardware and software; product research, custom design and testing for new product development in the fields of integrated circuits, semiconductors and electronics; technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems and integrated circuits; technical consultancy in regard to the design and use of computerized systems and machines used in the manufacture and preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; Technical support, namely, monitoring technological functions of computer network systems and computerized machines used in the manufacture and preparation of semiconductor components, integrated circuits, semiconductor chips, semiconductor chip sets, circuit board assemblies, computer components and electronic components; technology consultation services regarding the design, testing and manufacture of semiconductors, integrated circuits, electronics and flexible electronic circuits; custom testing of semiconductors, integrated circuits and electronics for others; information, advisory and consultancy services relating to the aforesaid
Additional Information
Design Mark
The mark consists of a stylized letter P in yellow where the top part is formed by a slanted water drop and the bottom part is formed by a semi-circle. The color white represents transparent areas and background and is not claimed as a feature of the mark.
Color Claim
The color(s) yellow is/are claimed as a feature of the mark.
Pseudo Mark
PRAGMATIC
Classification
International Classes
007
009
040
042