Legal Representation
Attorney
Hun Joon Kim
USPTO Deadlines
Next Deadline
1592 days remaining
Section 8 (6-Year) Declaration Due (Based on registration date 2024-03-05)
Due Date
March 05, 2030
Grace Period Ends
September 05, 2030
Additional deadlines exist. Contact your attorney for complete deadline information.
Application History
32 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Dec 30, 2024 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
| Dec 30, 2024 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Dec 30, 2024 | ECDR | I | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS | Loading... |
| Dec 30, 2024 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
| Jun 6, 2024 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... |
| Jun 6, 2024 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... |
| Jun 6, 2024 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... |
| Mar 5, 2024 | NRCC | E | NOTICE OF REGISTRATION CONFIRMATION EMAILED | Loading... |
| Mar 5, 2024 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Dec 19, 2023 | GPNX | P | NOTIFICATION PROCESSED BY IB | Loading... |
| Dec 19, 2023 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
| Dec 19, 2023 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Nov 29, 2023 | OP2R | P | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | Loading... |
| Nov 29, 2023 | NONP | E | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | Loading... |
| Nov 29, 2023 | OPNS | P | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | Loading... |
| Nov 14, 2023 | XAEC | I | EXAMINER'S AMENDMENT ENTERED | Loading... |
| Nov 14, 2023 | GNEN | O | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED | Loading... |
| Nov 14, 2023 | GNEA | O | EXAMINERS AMENDMENT E-MAILED | Loading... |
| Nov 14, 2023 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Nov 14, 2023 | CNEA | R | EXAMINERS AMENDMENT -WRITTEN | Loading... |
| Nov 9, 2023 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Nov 8, 2023 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 8, 2023 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| May 31, 2023 | RFNP | P | REFUSAL PROCESSED BY IB | Loading... |
| May 11, 2023 | RFCS | P | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | Loading... |
| May 10, 2023 | RFRR | P | REFUSAL PROCESSED BY MPU | Loading... |
| Mar 21, 2023 | RFCR | E | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | Loading... |
| Mar 20, 2023 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Mar 9, 2023 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jan 31, 2023 | MAFR | O | APPLICATION FILING RECEIPT MAILED | Loading... |
| Jan 27, 2023 | NWOS | I | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | Loading... |
| Jan 26, 2023 | REPR | M | SN ASSIGNED FOR SECT 66A APPL FROM IB | Loading... |
Detailed Classifications
Class 007
Chucks being parts of semiconductor etching machines; rings other than for land vehicles, namely, metal seal rings and ceramic seal rings, being parts of machines for manufacturing semiconductors; machine parts, namely, hoods; hoods being parts of semiconductor etching machines; rings being parts of semiconductor etching machines, namely, ceramic focus rings, ceramic seal rings and ceramic rings for providing thermal insulation; ceramic tubes being parts of semiconductor wafer processing machines; ceramic pipes being parts of semiconductor wafer processing machines; ceramic panels being parts of semiconductor wafer processing machines; gas distributing plates being parts of semiconductor manufacturing machines; multi-layered ceramic boards being parts of semiconductor manufacturing machines; plasma etching machines; robotic arms being parts of semiconductor etching machines; electrodes being parts of semiconductor wafer processing machines; ceramic focus rings and ceramic seal rings being parts of machines for manufacturing semiconductors; ceramic rings for providing thermal insulation, being parts of machines for manufacturing semiconductors
Additional Information
Design Mark
The mark consists of the letters "SK" in red stylized font and "ENPULSE" in orange stylized font. To the top right of the "SK" is a design of wings. The inner portion of the wings is red, and the outer portion of the wings is orange. White is not claimed as a feature of the mark and only represents background or transparent areas.
Color Claim
The color(s) red and orange is/are claimed as a feature of the mark.
Classification
International Classes
007