MAGSIC

Serial Number 79179389
Registration 5033864
706

Registration Progress

Application Filed
Oct 21, 2015
Under Examination
Approved for Publication
Jun 21, 2016
Published for Opposition
Jun 21, 2016
Registered
Sep 6, 2016

Attorney Assistance

Section 71 Renewal Due (Principal Register 66a) (Based on registration date 20160906)
Due: Sep 06, 2026 253 days

Trademark Image

MAGSIC

Basic Information

Serial Number
79179389
Registration Number
5033864
Filing Date
October 21, 2015
Registration Date
September 6, 2016
Published for Opposition
June 21, 2016
Drawing Code
4

Status Summary

Current Status
Active
Status Code
706
Status Date
Aug 4, 2022
Registration
Registered
Classes
006 009

Rights Holder

A.L.M.T. Corp.

03
Address
8-21-1, Ginza, Chuo-ku
Tokyo 104-0061
JP

Ownership History

A.L.M.T. Corp.

Original Applicant
03
JP

A.L.M.T. Corp.

Owner at Publication
03
JP

A.L.M.T. Corp.

Original Registrant
03
JP

Legal Representation

Attorney
LEIGH ANN LINDQUIST

USPTO Deadlines

Next Deadline
253 days remaining
Section 71 Renewal Due (Principal Register 66a) (Based on registration date 20160906)
Due Date
September 06, 2026
Grace Period Ends
March 06, 2027

Application History

37 events
Date Code Type Description Documents
Sep 6, 2025 REM4 E COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED Loading...
Jul 10, 2025 RNWL P INTERNATIONAL REGISTRATION RENEWED Loading...
May 13, 2023 ADCH M CHANGE OF NAME/ADDRESS REC'D FROM IB Loading...
Aug 4, 2022 NA71 E NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED Loading...
Aug 4, 2022 71AG O REGISTERED-SEC.71 ACCEPTED Loading...
Aug 2, 2022 APRE A CASE ASSIGNED TO POST REGISTRATION PARALEGAL Loading...
Mar 2, 2022 ES71 I TEAS SECTION 71 RECEIVED Loading...
Sep 6, 2021 REM3 E COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED Loading...
Dec 14, 2019 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Loading...
Dec 14, 2019 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...
Jun 14, 2018 NREP P NEW REPRESENTATIVE AT IB RECEIVED Loading...
Feb 17, 2017 FINO P FINAL DECISION TRANSACTION PROCESSED BY IB Loading...
Jan 23, 2017 FICS P FINAL DISPOSITION NOTICE SENT TO IB Loading...
Jan 23, 2017 FIMP P FINAL DISPOSITION PROCESSED Loading...
Dec 6, 2016 FICR P FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB Loading...
Oct 12, 2016 OPNX P NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB Loading...
Sep 6, 2016 R.PR A REGISTERED-PRINCIPAL REGISTER Loading...
Jun 21, 2016 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Jun 21, 2016 PUBO A PUBLISHED FOR OPPOSITION Loading...
Jun 1, 2016 OPNS P NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB Loading...
Jun 1, 2016 OP2R P NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB Loading...
Jun 1, 2016 NONP E NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Loading...
May 16, 2016 PREV O LAW OFFICE PUBLICATION REVIEW COMPLETED Loading...
May 10, 2016 CNSA O APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
May 10, 2016 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
May 10, 2016 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
May 5, 2016 ALIE A ASSIGNED TO LIE Loading...
Apr 22, 2016 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Mar 4, 2016 RFNT P REFUSAL PROCESSED BY IB Loading...
Feb 17, 2016 RFCS P NON-FINAL ACTION MAILED - REFUSAL SENT TO IB Loading...
Feb 17, 2016 RFRR P REFUSAL PROCESSED BY MPU Loading...
Feb 17, 2016 RFCR E NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW Loading...
Feb 16, 2016 CNRT R NON-FINAL ACTION WRITTEN Loading...
Feb 11, 2016 DOCK D ASSIGNED TO EXAMINER Loading...
Jan 5, 2016 MAFR O APPLICATION FILING RECEIPT MAILED Loading...
Dec 31, 2015 NWOS I NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Loading...
Dec 30, 2015 REPR M SN ASSIGNED FOR SECT 66A APPL FROM IB Loading...

Detailed Classifications

Class 006
Composite materials composed primarily of magnesium alloy and also containing silicon carbide for heat radiation and transfer; non-ferrous metals and their alloys
Class 009
Heat radiation transfer components for semiconductor devices made of composite materials composed of magnesium and silicon carbide; heat spreaders for semiconductor devices made of composite materials composed of magnesium and silicon carbide; heat radiation components for semiconductor devices; heat spreaders for semiconductor devices

Classification

International Classes
006 009