Legal Representation
Attorney
                                            Jeffrey H. Kaufman
                                        USPTO Deadlines
                                Next Deadline
                            
                            
                                    
                                        
                                        2188 days remaining
                                    
                            
                        Section 8 & 9 (20-Year) Renewal Due (Based on registration date 2011-11-01)
                                    
                                    Due Date
                                
                                
                                    November 01, 2031
                                
                            
                                        
                                        Grace Period Ends
                                    
                                    
                                        May 01, 2032
                                    
                                Application History
50 events| Date | Code | Type | Description | Documents | 
|---|---|---|---|---|
| Mar 16, 2023 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... | 
| Mar 16, 2023 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... | 
| Mar 16, 2023 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... | 
| Mar 13, 2023 | INNP | P | PARTIAL INVALIDATION PROCESSED BY THE IB | Loading... | 
| Feb 14, 2023 | INPC | P | INVALIDATION PROCESSED | Loading... | 
| Feb 14, 2023 | LIMN | I | LIMITATION FROM THE IB EXAMINED, NO ACTION IS NEEDED | Loading... | 
| Feb 14, 2023 | INPS | P | PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB | Loading... | 
| Dec 18, 2022 | INPR | P | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | Loading... | 
| Apr 5, 2022 | NA71 | E | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED | Loading... | 
| Apr 5, 2022 | 71AG | O | REGISTERED-SEC.71 ACCEPTED | Loading... | 
| Apr 5, 2022 | A7OK | O | AMENDMENT UNDER SECTION 7 - PROCESSED | Loading... | 
| Mar 21, 2022 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... | 
| Aug 9, 2021 | ES71 | I | TEAS SECTION 71 RECEIVED | Loading... | 
| Aug 4, 2021 | ES7R | I | TEAS SECTION 7 REQUEST RECEIVED | Loading... | 
| Nov 1, 2020 | REM4 | E | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED | Loading... | 
| Jun 4, 2020 | RNWL | P | INTERNATIONAL REGISTRATION RENEWED | Loading... | 
| Dec 6, 2018 | ADCH | M | CHANGE OF NAME/ADDRESS REC'D FROM IB | Loading... | 
| Jan 18, 2018 | C75A | O | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. | Loading... | 
| Jan 18, 2018 | NA75 | E | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED | Loading... | 
| Nov 14, 2017 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... | 
| Oct 12, 2017 | ES75 | I | TEAS SECTION 71 & 15 RECEIVED | Loading... | 
| Nov 1, 2016 | REM3 | E | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED | Loading... | 
| Apr 13, 2013 | LIMG | M | LIMITATION OF GOODS RECEIVED FROM IB | Loading... | 
| Jul 27, 2012 | FINO | P | FINAL DECISION TRANSACTION PROCESSED BY IB | Loading... | 
| Jun 6, 2012 | FIMP | P | FINAL DISPOSITION PROCESSED | Loading... | 
| Jun 6, 2012 | FICS | P | FINAL DISPOSITION NOTICE SENT TO IB | Loading... | 
| Feb 1, 2012 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... | 
| Nov 26, 2011 | GPNX | P | NOTIFICATION PROCESSED BY IB | Loading... | 
| Nov 1, 2011 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... | 
| Aug 16, 2011 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... | 
| Aug 16, 2011 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... | 
| Aug 3, 2011 | OP2R | P | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | Loading... | 
| Aug 3, 2011 | OPNS | P | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | Loading... | 
| Jul 14, 2011 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... | 
| Jul 7, 2011 | ALIE | A | ASSIGNED TO LIE | Loading... | 
| Jul 7, 2011 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... | 
| Jun 20, 2011 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... | 
| Jun 20, 2011 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... | 
| Jun 20, 2011 | ERFR | I | TEAS REQUEST FOR RECONSIDERATION RECEIVED | Loading... | 
| May 5, 2011 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... | 
| May 5, 2011 | GNFN | O | NOTIFICATION OF FINAL REFUSAL EMAILED | Loading... | 
| May 5, 2011 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... | 
| Apr 14, 2011 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... | 
| Apr 14, 2011 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... | 
| Apr 14, 2011 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... | 
| Apr 14, 2011 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... | 
| Apr 14, 2011 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... | 
| Nov 2, 2010 | RFNT | P | REFUSAL PROCESSED BY IB | Loading... | 
| Oct 14, 2010 | RFRR | P | REFUSAL PROCESSED BY MPU | Loading... | 
| Oct 14, 2010 | RFCS | P | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | Loading... | 
Detailed Classifications
                                                Class 007
                                            
                                        Machines used in assembly lines, namely, placers, mounters and inserters of electronic components for manufacturing and assembling printed circuit boards; electronic component inserters for machines used in manufacturing and assembling printed circuit boards; industrial printing machines, namely, screen printers for manufacturing and assembling printed circuit boards; power-operated viscous fluid dispensers for machines used in manufacturing and assembling printed circuit boards; [ machines for manufacturing and assembling printed circuit boards,] [, namely, adhesive curing machines for assembling printed circuit boards; autogenous soldering machines used for manufacturing and assembling printed circuit boards; machines for manufacturing and assembling printed circuit boards, namely, feeders of printed circuit boards; parts of machines exclusively used for provisional storing of printed circuit boards in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards; machines for manufacturing and assembling printed circuit boards, namely, machines that reverse the orientation of circuit boards; machines for manufacturing and assembling printed circuit boards, namely, machines that rotate circuit boards; power-operated tools, namely, buffers for printed circuit boards; loading and unloading machines for manufacturing and assembling printed circuit boards; adhesive tape dispensing machines for electronic component placers, mounters and inserters; ] machines for manufacturing and assembling printed circuit boards, namely, electronic component feeders; machines for manufacturing semiconductors; metalworking machines and tools; power-operated metalworking machine tools, namely, turning tools; lathes for metalworking; machining centres [ ; plasma, being ionized gas, processing machines for use in the manufacturing and assembling of printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries; plasma, being ionized gas, cleaning machines for use in the manufacturing and assembling of printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries; plasma, being ionized gas, reforming machines for use in the manufacturing and assembling of printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries; plasma, being ionized gas, sterilization machines for use in the manufacturing and assembling of printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries; plasma, being ionized gas, surface treatment machines for use in the manufacturing and assembling of printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries; automatic assemblinglasma, being ionized gas, modification machines for use in the manufacturing and assembling of printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries; automatic assembling machines for assembling circuit boards, LED circuit boards, electronic circuits, telecommunication devices and apparatus, photographic instruments and apparatus, cinematographic instruments and apparatus, lighting apparatus, LED light machines, power distribution or control machines and apparatus, batteries and cells, AC motors and DC motors, parts for automobiles, metalworking machines, medical machines and game machines ]
                                        Additional Information
                                                
                                                Design Mark
                                            
                                        The mark consists of a diamond design composed of nine smaller shaded diamonds with the wording "FUJI" and "Innovative Spirit" in stylized font.
                                    
                                                
                                                Color Claim
                                            
                                        Color is not claimed as a feature of the mark.
                                    
                                                
                                                Other
                                            
                                        In the statement, line 13, "namely, adhesive curing machines for assembling" is deleted; lines 14-27 is deleted; line 28 "printed circuit boards" is deleted; line 31 "plasma, being ionized" is deleted; lines 32-36 is deleted. Page 2 lines 1-26 is deleted. 
                                    Classification
                                            
                                            International Classes
                                        
                                        
                                                    007