Legal Representation
Attorney
Jeffrey H. Kaufman
USPTO Deadlines
Next Deadline
2340 days remaining
Section 8 & 9 (20-Year) Renewal Due (Based on registration date 2011-12-13)
Due Date
December 13, 2031
Grace Period Ends
June 13, 2032
Application History
50 eventsDate | Code | Type | Description | Documents |
---|---|---|---|---|
Mar 20, 2023 | INNP | P | PARTIAL INVALIDATION PROCESSED BY THE IB | Loading... |
Mar 16, 2023 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
Mar 16, 2023 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
Mar 16, 2023 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
Jan 24, 2023 | INPC | P | INVALIDATION PROCESSED | Loading... |
Jan 24, 2023 | INPS | P | PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB | Loading... |
Dec 4, 2022 | INPR | P | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | Loading... |
Apr 4, 2022 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
Apr 4, 2022 | 71AG | O | REGISTERED-SEC.71 ACCEPTED | Loading... |
Apr 4, 2022 | NA71 | E | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED | Loading... |
Aug 30, 2021 | ES71 | I | TEAS SECTION 71 RECEIVED | Loading... |
Dec 13, 2020 | REM4 | E | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED | Loading... |
Jun 4, 2020 | RNWL | P | INTERNATIONAL REGISTRATION RENEWED | Loading... |
Dec 6, 2018 | ADCH | M | CHANGE OF NAME/ADDRESS REC'D FROM IB | Loading... |
May 1, 2018 | CORV | 2 | REVIEW OF CORRESPONDENCE COMPLETE - ADDRESS NOT UPDATED | Loading... |
Apr 23, 2018 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
Mar 13, 2018 | C75A | O | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. | Loading... |
Mar 13, 2018 | NA75 | E | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED | Loading... |
Nov 14, 2017 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
Oct 12, 2017 | ES75 | I | TEAS SECTION 71 & 15 RECEIVED | Loading... |
Dec 13, 2016 | REM3 | E | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED | Loading... |
Jun 26, 2014 | INNA | R | INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE | Loading... |
Jan 8, 2014 | INPR | P | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED | Loading... |
May 8, 2013 | PLGL | A | ASSIGNED TO PARALEGAL | Loading... |
May 8, 2013 | COC. | O | CORRECTION UNDER SECTION 7 - PROCESSED | Loading... |
May 8, 2013 | LIME | I | LIMITATION FROM THE IB EXAMINED AND ENTERED | Loading... |
Feb 4, 2013 | LIMG | M | LIMITATION OF GOODS RECEIVED FROM IB | Loading... |
May 25, 2012 | GPNX | P | NOTIFICATION PROCESSED BY IB | Loading... |
Apr 13, 2012 | FINO | P | FINAL DECISION TRANSACTION PROCESSED BY IB | Loading... |
Mar 19, 2012 | FIMP | P | FINAL DISPOSITION PROCESSED | Loading... |
Mar 19, 2012 | FICS | P | FINAL DISPOSITION NOTICE SENT TO IB | Loading... |
Mar 13, 2012 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... |
Dec 13, 2011 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
Sep 27, 2011 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
Sep 27, 2011 | NPUB | E | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | Loading... |
Sep 7, 2011 | OP2R | P | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | Loading... |
Sep 7, 2011 | OPNS | P | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | Loading... |
Aug 22, 2011 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
Aug 16, 2011 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
Jul 15, 2011 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Jul 15, 2011 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
Jun 30, 2011 | ALIE | A | ASSIGNED TO LIE | Loading... |
Jun 20, 2011 | ERFR | I | TEAS REQUEST FOR RECONSIDERATION RECEIVED | Loading... |
Apr 5, 2011 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... |
Apr 5, 2011 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
Apr 5, 2011 | GNFN | O | NOTIFICATION OF FINAL REFUSAL EMAILED | Loading... |
Mar 11, 2011 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
Mar 11, 2011 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
Mar 11, 2011 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
Mar 11, 2011 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
Detailed Classifications
Class 007
Machines used in assembly lines, namely, placers, mounters and inserters of electronic components for manufacturing and assembling printed circuit boards; electronic component inserters for machines used in manufacturing and assembling printed circuit boards; industrial printing machines, namely, screen printers for manufacturing and assembling printed circuit boards; power-operated viscous fluid dispensers for machines used in manufacturing and assembling printed circuit boards; [ machines for manufacturing and assembling printed circuit boards, namely, adhesive curing machines for assembling printed circuit boards; autogenous soldering machines used for manufacturing and assembling printed circuit boards; machines for manufacturing and assembling printed circuit boards, namely, feeders of printed circuit boards; parts of machines exclusively used for provisional storing of printed circuit boards in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards * for semiconductor manufacturing machines and systems *; machines for manufacturing and assembling printed circuit boards, namely, machines that reverse the orientation of circuit boards; machines for manufacturing and assembling printed circuit boards, namely, machines that rotate circuit boards; power-operated tools, namely, buffers for printed circuit boards * for semiconductor manufacturing machines and systems *; loading and unloading machines for manufacturing and assembling printed circuit boards * for semiconductor manufacturing machines and systems *; machine parts, namely, adhesive tape cartridges that dispense tape for electronic component placers, mounters and inserters used to manufacture and assemble printed circuit boards * for semiconductor manufacturing machines and systems *; ] machines for manufacturing and assembling printed circuit boards, namely, electronic component feeders * for semiconductor manufacturing machines and systems *; machines for manufacturing semiconductors; metalworking machines and tools; power-operated metalworking machine tools, namely, turning tools; lathes for metalworking; machining centres; [ automatic assembling machines for assembling printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries, namely, plasma processing machines, plasma cleaning machines, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, and plasma modification machines * apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof *; ] automatic assembling machines for assembling circuit boards, LED circuit boards, electronic circuits, telecommunication * machines * [ devices and apparatus ], photographic * machines * [ instruments and apparatus ], cinematographic * machines * [ instruments and apparatus, lighting apparatus, LED light machines ], power distribution or control machines [ and apparatus, batteries ] and * fuel cells, solar cells and secondary * cells, AC motors and DC motors, metalworking machines, medical machines and game machines
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Design Mark
The mark consists of a diamond design composed of nine smaller shaded diamonds.
Color Claim
Color is not claimed as a feature of the mark.
Other
In the statement, Page 1, line 36 through page 2, line 1 through 3 "plasma processing machines, plasma cleaning machines, namely, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, namely, and plasma modification machines" should be deleted, and "apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof" should be inserted.
Classification
International Classes
007