Serial Number 79085813
Registration 4069118
706

Registration Progress

Application Filed
May 13, 2010
Under Examination
Approved for Publication
Sep 27, 2011
Published for Opposition
Sep 27, 2011
Registered
Dec 13, 2011

Trademark Image

Basic Information

Serial Number
79085813
Registration Number
4069118
Filing Date
May 13, 2010
Registration Date
December 13, 2011
Published for Opposition
September 27, 2011
Drawing Code
2000

Status Summary

Current Status
Active
Status Code
706
Status Date
Apr 4, 2022
Registration
Registered
Classes
007

Rights Holder

FUJI CORPORATION

09
Address
19, Chausuyama, Yamamachi, Chiryu-shi
Aichi 472-8686
JP

Ownership History

FUJI MACHINE MFG. CO., LTD.

Original Applicant
09
Aichi JP

FUJI MACHINE MFG. CO., LTD.

Owner at Publication
09
Aichi JP

FUJI CORPORATION

Original Registrant
09
Aichi JP

Legal Representation

Attorney
Jeffrey H. Kaufman

USPTO Deadlines

Next Deadline
2340 days remaining
Section 8 & 9 (20-Year) Renewal Due (Based on registration date 2011-12-13)
Due Date
December 13, 2031
Grace Period Ends
June 13, 2032

Application History

50 events
Date Code Type Description Documents
Mar 20, 2023 INNP P PARTIAL INVALIDATION PROCESSED BY THE IB Loading...
Mar 16, 2023 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...
Mar 16, 2023 ARAA I ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Loading...
Mar 16, 2023 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
Jan 24, 2023 INPC P INVALIDATION PROCESSED Loading...
Jan 24, 2023 INPS P PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB Loading...
Dec 4, 2022 INPR P PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED Loading...
Apr 4, 2022 APRE A CASE ASSIGNED TO POST REGISTRATION PARALEGAL Loading...
Apr 4, 2022 71AG O REGISTERED-SEC.71 ACCEPTED Loading...
Apr 4, 2022 NA71 E NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED Loading...
Aug 30, 2021 ES71 I TEAS SECTION 71 RECEIVED Loading...
Dec 13, 2020 REM4 E COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED Loading...
Jun 4, 2020 RNWL P INTERNATIONAL REGISTRATION RENEWED Loading...
Dec 6, 2018 ADCH M CHANGE OF NAME/ADDRESS REC'D FROM IB Loading...
May 1, 2018 CORV 2 REVIEW OF CORRESPONDENCE COMPLETE - ADDRESS NOT UPDATED Loading...
Apr 23, 2018 APRE A CASE ASSIGNED TO POST REGISTRATION PARALEGAL Loading...
Mar 13, 2018 C75A O REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. Loading...
Mar 13, 2018 NA75 E NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED Loading...
Nov 14, 2017 APRE A CASE ASSIGNED TO POST REGISTRATION PARALEGAL Loading...
Oct 12, 2017 ES75 I TEAS SECTION 71 & 15 RECEIVED Loading...
Dec 13, 2016 REM3 E COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED Loading...
Jun 26, 2014 INNA R INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE Loading...
Jan 8, 2014 INPR P PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED Loading...
May 8, 2013 PLGL A ASSIGNED TO PARALEGAL Loading...
May 8, 2013 COC. O CORRECTION UNDER SECTION 7 - PROCESSED Loading...
May 8, 2013 LIME I LIMITATION FROM THE IB EXAMINED AND ENTERED Loading...
Feb 4, 2013 LIMG M LIMITATION OF GOODS RECEIVED FROM IB Loading...
May 25, 2012 GPNX P NOTIFICATION PROCESSED BY IB Loading...
Apr 13, 2012 FINO P FINAL DECISION TRANSACTION PROCESSED BY IB Loading...
Mar 19, 2012 FIMP P FINAL DISPOSITION PROCESSED Loading...
Mar 19, 2012 FICS P FINAL DISPOSITION NOTICE SENT TO IB Loading...
Mar 13, 2012 FICR P FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB Loading...
Dec 13, 2011 R.PR A REGISTERED-PRINCIPAL REGISTER Loading...
Sep 27, 2011 PUBO A PUBLISHED FOR OPPOSITION Loading...
Sep 27, 2011 NPUB E OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Loading...
Sep 7, 2011 OP2R P NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB Loading...
Sep 7, 2011 OPNS P NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB Loading...
Aug 22, 2011 PREV O LAW OFFICE PUBLICATION REVIEW COMPLETED Loading...
Aug 16, 2011 CNSA O APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
Jul 15, 2011 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Jul 15, 2011 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Jun 30, 2011 ALIE A ASSIGNED TO LIE Loading...
Jun 20, 2011 ERFR I TEAS REQUEST FOR RECONSIDERATION RECEIVED Loading...
Apr 5, 2011 CNFR R FINAL REFUSAL WRITTEN Loading...
Apr 5, 2011 GNFR O FINAL REFUSAL E-MAILED Loading...
Apr 5, 2011 GNFN O NOTIFICATION OF FINAL REFUSAL EMAILED Loading...
Mar 11, 2011 TROA I TEAS RESPONSE TO OFFICE ACTION RECEIVED Loading...
Mar 11, 2011 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
Mar 11, 2011 TEME I TEAS/EMAIL CORRESPONDENCE ENTERED Loading...
Mar 11, 2011 REAP I TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Loading...

Detailed Classifications

Class 007
Machines used in assembly lines, namely, placers, mounters and inserters of electronic components for manufacturing and assembling printed circuit boards; electronic component inserters for machines used in manufacturing and assembling printed circuit boards; industrial printing machines, namely, screen printers for manufacturing and assembling printed circuit boards; power-operated viscous fluid dispensers for machines used in manufacturing and assembling printed circuit boards; [ machines for manufacturing and assembling printed circuit boards, namely, adhesive curing machines for assembling printed circuit boards; autogenous soldering machines used for manufacturing and assembling printed circuit boards; machines for manufacturing and assembling printed circuit boards, namely, feeders of printed circuit boards; parts of machines exclusively used for provisional storing of printed circuit boards in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards * for semiconductor manufacturing machines and systems *; machines for manufacturing and assembling printed circuit boards, namely, machines that reverse the orientation of circuit boards; machines for manufacturing and assembling printed circuit boards, namely, machines that rotate circuit boards; power-operated tools, namely, buffers for printed circuit boards * for semiconductor manufacturing machines and systems *; loading and unloading machines for manufacturing and assembling printed circuit boards * for semiconductor manufacturing machines and systems *; machine parts, namely, adhesive tape cartridges that dispense tape for electronic component placers, mounters and inserters used to manufacture and assemble printed circuit boards * for semiconductor manufacturing machines and systems *; ] machines for manufacturing and assembling printed circuit boards, namely, electronic component feeders * for semiconductor manufacturing machines and systems *; machines for manufacturing semiconductors; metalworking machines and tools; power-operated metalworking machine tools, namely, turning tools; lathes for metalworking; machining centres; [ automatic assembling machines for assembling printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries, namely, plasma processing machines, plasma cleaning machines, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, and plasma modification machines * apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof *; ] automatic assembling machines for assembling circuit boards, LED circuit boards, electronic circuits, telecommunication * machines * [ devices and apparatus ], photographic * machines * [ instruments and apparatus ], cinematographic * machines * [ instruments and apparatus, lighting apparatus, LED light machines ], power distribution or control machines [ and apparatus, batteries ] and * fuel cells, solar cells and secondary * cells, AC motors and DC motors, metalworking machines, medical machines and game machines
First Use Anywhere: 0
First Use in Commerce: 0

Additional Information

Design Mark
The mark consists of a diamond design composed of nine smaller shaded diamonds.
Color Claim
Color is not claimed as a feature of the mark.
Other
In the statement, Page 1, line 36 through page 2, line 1 through 3 "plasma processing machines, plasma cleaning machines, namely, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, namely, and plasma modification machines" should be deleted, and "apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof" should be inserted.

Classification

International Classes
007