Legal Representation
Attorney
Jess M. Collen
USPTO Deadlines
Next Deadline
1474 days remaining
Section 8 & 9 (20-Year) Renewal Due (Based on registration date 2009-07-21)
Due Date
July 21, 2029
Grace Period Ends
January 21, 2030
Application History
41 events| Date | Code | Type | Description |
|---|---|---|---|
| Sep 18, 2020 | INNP | P | PARTIAL INVALIDATION PROCESSED BY THE IB |
| Jun 3, 2020 | XXCR | P | GENERIC MADRID TRANSACTION CREATED |
| Jun 3, 2020 | XXSS | O | GENERIC MADRID TRANSACTION SENT TO IB |
| Mar 26, 2020 | INPR | P | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED |
| Jul 26, 2019 | 71AG | O | REGISTERED-SEC.71 ACCEPTED |
| Jul 26, 2019 | NA71 | E | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED |
| Jul 19, 2019 | ES71 | I | TEAS SECTION 71 RECEIVED |
| Jul 21, 2018 | REM4 | E | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED |
| Mar 29, 2018 | RNWL | P | INTERNATIONAL REGISTRATION RENEWED |
| Feb 23, 2016 | CORR | I | CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED |
| Jan 31, 2016 | CRCV | M | CORRECTION TRANSACTION RECEIVED FROM IB |
| Sep 3, 2015 | ADCH | M | CHANGE OF NAME/ADDRESS REC'D FROM IB |
| Aug 18, 2015 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| Aug 18, 2015 | C75A | O | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. |
| Aug 18, 2015 | NA75 | E | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED |
| Jul 16, 2015 | ES75 | I | TEAS SECTION 71 & 15 RECEIVED |
| Jan 28, 2013 | FINO | P | FINAL DECISION TRANSACTION PROCESSED BY IB |
| Nov 2, 2009 | FIMP | P | FINAL DISPOSITION PROCESSED |
| Nov 2, 2009 | FICS | P | FINAL DISPOSITION NOTICE SENT TO IB |
| Oct 22, 2009 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| Jul 21, 2009 | R.PR | A | REGISTERED-PRINCIPAL REGISTER |
| May 5, 2009 | PUBO | A | PUBLISHED FOR OPPOSITION |
| Apr 15, 2009 | NPUB | O | NOTICE OF PUBLICATION |
| Mar 30, 2009 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED |
| Mar 26, 2009 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Mar 9, 2009 | ALIE | A | ASSIGNED TO LIE |
| Mar 9, 2009 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Mar 9, 2009 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Mar 6, 2009 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Mar 5, 2009 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Mar 5, 2009 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Oct 24, 2008 | RFNT | P | REFUSAL PROCESSED BY IB |
| Sep 29, 2008 | RFRR | P | REFUSAL PROCESSED BY MPU |
| Sep 29, 2008 | RFCS | P | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Sep 27, 2008 | RFCR | E | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Sep 26, 2008 | CNRT | R | NON-FINAL ACTION WRITTEN |
| Sep 22, 2008 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Sep 22, 2008 | ZZZX | Z | PREVIOUS ALLOWANCE COUNT WITHDRAWN |
| Sep 19, 2008 | NWAP | I | NEW APPLICATION ENTERED |
| Sep 19, 2008 | DOCK | D | ASSIGNED TO EXAMINER |
| Sep 18, 2008 | REPR | M | SN ASSIGNED FOR SECT 66A APPL FROM IB |
Detailed Classifications
Class 007
[ Automatic laser cutting machines for glass; cutting machines, namely, automatic laser chamfering machines for glass, laser working machines for scribing and breaking glass, ] automatic cutting machines for glass, automatic chamfering machines for glass, glass working machines for scribing and breaking glass, [ automatic laser cutting machines for ceramic substrates, automatic laser chamfering machines for ceramic substrates, laser working machines for scribing and breaking ceramic substrates, ] automatic cutting machines for ceramic substrates, automatic chamfering machines for ceramic substrates, working machines for ceramic substrates for scribing and breaking, [ automatic laser cutting machines for semiconductor substrates, automatic laser chamfering machines for semiconductor substrates, laser working machines for scribing and breaking semiconductor substrates, ] automatic cutting machines for semiconductor substrates, automatic chamfering machines for semiconductor substrates, working machines for scribing and breaking semiconductor substrates; machines for manufacturing of flat panel display screens [ ; machines for manufacturing of semiconductors; cemented carbide cutting tools for scribing glass; diamond machine tools, namely, diamond-pointed tools for scribing glass; diamond grinding machines for grinding glass; metalworking machines, namely, grinding machines ]
First Use Anywhere:
0
First Use in Commerce:
0
Class 008
Component parts of hand operated diamond-pointed glass cutters, namely, glaziers' diamonds; hand tools, namely, cemented carbide glass cutters; hand tools for cutting, namely, hand cutters for glass
First Use Anywhere:
0
First Use in Commerce:
0
Classification
International Classes
007
008