Legal Representation
Attorney
M. SCOTT ALPRIN
USPTO Deadlines
Next Deadline
1013 days remaining
Section 8 & 9 (20-Year) Renewal Due (Based on registration date 2008-05-13)
Due Date
May 13, 2028
Grace Period Ends
November 13, 2028
Application History
42 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Sep 9, 2022 | ADCH | M | CHANGE OF NAME/ADDRESS REC'D FROM IB | Loading... |
| May 9, 2021 | NREP | P | NEW REPRESENTATIVE AT IB RECEIVED | Loading... |
| May 12, 2018 | C75A | O | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. | Loading... |
| May 12, 2018 | NA75 | E | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED | Loading... |
| May 9, 2018 | ES75 | I | TEAS SECTION 71 & 15 RECEIVED | Loading... |
| May 13, 2017 | REM4 | E | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED | Loading... |
| Dec 22, 2016 | RNWL | P | INTERNATIONAL REGISTRATION RENEWED | Loading... |
| Jun 5, 2015 | NREP | P | NEW REPRESENTATIVE AT IB RECEIVED | Loading... |
| May 30, 2014 | REAP | I | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | Loading... |
| May 30, 2014 | ARAA | I | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | Loading... |
| May 16, 2014 | 71AF | I | REGISTERED-SEC.71 FILED | Loading... |
| May 16, 2014 | 71AG | O | REGISTERED-SEC.71 ACCEPTED | Loading... |
| May 16, 2014 | NA71 | O | NOTICE OF ACCEPTANCE OF SEC. 71 - MAILED | Loading... |
| May 13, 2014 | ES71 | I | TEAS SECTION 71 RECEIVED | Loading... |
| Dec 30, 2012 | FINO | P | FINAL DECISION TRANSACTION PROCESSED BY IB | Loading... |
| Jan 13, 2010 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Feb 18, 2009 | TCCA | I | TEAS CHANGE OF CORRESPONDENCE RECEIVED | Loading... |
| Sep 3, 2008 | FIMP | P | FINAL DISPOSITION PROCESSED | Loading... |
| Sep 3, 2008 | FICS | P | FINAL DISPOSITION NOTICE SENT TO IB | Loading... |
| Aug 30, 2008 | COC. | O | CORRECTION UNDER SECTION 7 - PROCESSED | Loading... |
| Aug 19, 2008 | PLGL | A | ASSIGNED TO PARALEGAL | Loading... |
| Aug 13, 2008 | FICR | P | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | Loading... |
| Jul 22, 2008 | ES7R | I | TEAS SECTION 7 REQUEST RECEIVED | Loading... |
| May 13, 2008 | R.PR | A | REGISTERED-PRINCIPAL REGISTER | Loading... |
| Feb 26, 2008 | PUBO | A | PUBLISHED FOR OPPOSITION | Loading... |
| Feb 6, 2008 | NPUB | O | NOTICE OF PUBLICATION | Loading... |
| Jan 24, 2008 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| Jan 23, 2008 | CNSA | O | APPROVED FOR PUB - PRINCIPAL REGISTER | Loading... |
| Dec 21, 2007 | LIEC | X | LEGAL INSTRUMENT EXAMINER (LIE) - CORRECTION | Loading... |
| Dec 21, 2007 | ACEC | I | AMENDMENT FROM APPLICANT ENTERED | Loading... |
| Nov 29, 2007 | IROA | I | RESPONSE TO ITU OFFICE ACTION ENTERED | Loading... |
| Nov 28, 2007 | ALIE | A | ASSIGNED TO LIE | Loading... |
| Oct 19, 2007 | I | PAPER RECEIVED | Loading... | |
| Oct 19, 2007 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| May 17, 2007 | RFNT | P | REFUSAL PROCESSED BY IB | Loading... |
| Apr 26, 2007 | RFRR | P | REFUSAL PROCESSED BY MPU | Loading... |
| Apr 26, 2007 | RFCS | P | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | Loading... |
| Apr 22, 2007 | RFCR | E | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | Loading... |
| Apr 21, 2007 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Apr 13, 2007 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
| Apr 13, 2007 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Apr 12, 2007 | REPR | M | SN ASSIGNED FOR SECT 66A APPL FROM IB | Loading... |
Detailed Classifications
Class 007
Automatic laser cutting machines for glass; Automatic laser chamfering machines for glass; Laser working machines for scribing and breaking glass; Automatic cutting machines for glass; Automatic chamfering machines for glass; Glass working machines for scribing and breaking glass; Automatic laser cutting machines for ceramic substrates; Automatic laser chamfering machines for ceramic substrates; Laser working machines for scribing and breaking ceramic substrates; Automatic cutting machines for ceramic substrates; Automatic chamfering machines for ceramic substrates; Working machines for ceramic substrates for scribing and breaking; Automatic laser cutting machines for semiconductor substrates; Automatic laser chamfering machines for semiconductor substrates; Laser working machines for scribing and breaking semiconductor substrates; Automatic cutting machines for semiconductor substrates; Automatic chamfering machines for semiconductor substrates; Working machines for scribing and breaking semiconductor substrates; Machines for manufacturing for flat panel display screens; Machines for manufacturing for semiconductors; Cemented carbide tools for scribing glass; Diamond tools, namely, diamond-pointed tools for scribing glass; Cemented carbide tools for scribing glass; Diamond grinding machines; Metalworking machines, namely, grinding machines
First Use Anywhere:
0
First Use in Commerce:
0
Class 008
Glaziers' diamonds as parts of hand tools, namely, diamond-pointed glass cutters; Hand tools, namely, cemented carbide glass cutters; Hand tools for cutting tools, namely, hand cutters for glass
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Color Claim
Color is not claimed as a feature of the mark.
Other
In the statement, column 1, lines 10 and 30, CUFFING should be deleted, and CUTTING should be inserted.
Pseudo Mark
MITSUBOSHI DIAMOND INDUSTRIAL
Classification
International Classes
007
008