Legal Representation
Attorney
James M. Slattery (Reg. No. 28,380)
USPTO Deadlines
Application History
18 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Nov 13, 2006 | ABN2 | O | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE | Loading... |
| Nov 13, 2006 | MAB2 | O | ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND | Loading... |
| Apr 17, 2006 | CNCF | S | ACTION CONTINUING FINAL - COMPLETED | Loading... |
| Apr 17, 2006 | GECD | O | ACTION DENYING REQ FOR RECON E-MAILED | Loading... |
| Apr 4, 2006 | ACEC | I | AMENDMENT FROM APPLICANT ENTERED | Loading... |
| Mar 9, 2006 | I | PAPER RECEIVED | Loading... | |
| Mar 9, 2006 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Nov 7, 2005 | CNFR | R | FINAL REFUSAL WRITTEN | Loading... |
| Nov 7, 2005 | GNFR | O | FINAL REFUSAL E-MAILED | Loading... |
| Oct 20, 2005 | ACEC | I | AMENDMENT FROM APPLICANT ENTERED | Loading... |
| Oct 5, 2005 | I | PAPER RECEIVED | Loading... | |
| Oct 5, 2005 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Apr 25, 2005 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Apr 25, 2005 | GNRT | O | NON-FINAL ACTION E-MAILED | Loading... |
| Apr 11, 2005 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Apr 11, 2005 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Mar 29, 2005 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Sep 8, 2004 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 009
Flash memory card; floating-point operation computer chip; blank electronic chip cards, namely, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data;integrated circuits; memory cards, namely, DRAM memory modules; computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structured semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor mem;oryunits; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; copper wafers, potassium arsenide wafers
First Use Anywhere:
0
First Use in Commerce:
0
Additional Information
Design Mark
The design in the mark consists of two numerals, "9" is on top and the other at the bottom.
Classification
International Classes
009
Disclaimers
The following terms have been disclaimed and are not claimed as part of the trademark:
General Disclaimer
"CSP"