Legal Representation
Attorney
Arno T. Naeckel
USPTO Deadlines
Next Deadline
In Grace Period
Section 8 & 9 Renewal Due (Supplemental Register) (Based on registration date 20050726)
Due Date
July 26, 2025
Grace Period Ends
January 26, 2026
Application History
21 events| Date | Code | Type | Description | Documents |
|---|---|---|---|---|
| Jul 26, 2024 | REM2 | E | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED | Loading... |
| Jul 17, 2015 | NA89 | E | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED | Loading... |
| Jul 17, 2015 | RNL1 | Q | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) | Loading... |
| Jul 17, 2015 | 89AG | O | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED | Loading... |
| Jul 16, 2015 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Jun 23, 2015 | E89R | I | TEAS SECTION 8 & 9 RECEIVED | Loading... |
| Aug 19, 2011 | NAS8 | E | NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED | Loading... |
| Aug 18, 2011 | 8.OK | O | REGISTERED - SEC. 8 (6-YR) ACCEPTED | Loading... |
| Aug 18, 2011 | APRE | A | CASE ASSIGNED TO POST REGISTRATION PARALEGAL | Loading... |
| Jul 25, 2011 | ES8R | I | TEAS SECTION 8 RECEIVED | Loading... |
| Jul 26, 2005 | R.SR | A | REGISTERED-SUPPLEMENTAL REGISTER | Loading... |
| Jun 7, 2005 | PREV | O | LAW OFFICE PUBLICATION REVIEW COMPLETED | Loading... |
| May 23, 2005 | ALIE | A | ASSIGNED TO LIE | Loading... |
| May 17, 2005 | CNTA | O | APPROVED FOR REGISTRATION SUPPLEMENTAL REGISTER | Loading... |
| Apr 26, 2005 | TEME | I | TEAS/EMAIL CORRESPONDENCE ENTERED | Loading... |
| Apr 12, 2005 | CRFA | I | CORRESPONDENCE RECEIVED IN LAW OFFICE | Loading... |
| Apr 12, 2005 | TROA | I | TEAS RESPONSE TO OFFICE ACTION RECEIVED | Loading... |
| Jan 19, 2005 | GNRT | F | NON-FINAL ACTION E-MAILED | Loading... |
| Jan 19, 2005 | CNRT | R | NON-FINAL ACTION WRITTEN | Loading... |
| Jan 5, 2005 | DOCK | D | ASSIGNED TO EXAMINER | Loading... |
| Jun 8, 2004 | NWAP | I | NEW APPLICATION ENTERED | Loading... |
Detailed Classifications
Class 040
custom manufacture of semiconductor wafers and semiconductor chips, namely, application of solder bumps to semiconductor wafers and semiconductor chips
First Use Anywhere:
Feb 6, 2004
First Use in Commerce:
Feb 6, 2004
Additional Information
Pseudo Mark
FLIP CHIP INTERNATIONAL
Classification
International Classes
040
Disclaimers
The following terms have been disclaimed and are not claimed as part of the trademark:
Specific Disclaimer
"INTERNATIONAL"