UCSP

Serial Number 78141122
606

Registration Progress

Application Filed
Jul 3, 2002
Under Examination
Nov 11, 2003
Approved for Publication
Jul 30, 2003
Published for Opposition
Aug 19, 2003
Registered

Re-Apply for This Trademark

This trademark is no longer active. You may be able to file a new application for the same or similar mark.
Mark: UCSP
Previous Owner: FLIP CHIP TECHNOLOGIES, LLC
Classes: 009

Trademark Image

UCSP

Basic Information

Serial Number
78141122
Filing Date
July 3, 2002
Published for Opposition
August 19, 2003
Abandonment Date
November 12, 2004
Drawing Code
1000

Status Summary

Current Status
Inactive
Status Code
606
Status Date
Nov 12, 2004
Classes
009

Rights Holder

FLIP CHIP TECHNOLOGIES, LLC

03
Address
3701 E. University Drive
Phoenix, AZ 85034

Ownership History

Kulicke & Soffa Investments Inc.

Original Applicant
03
Wilmington, DE

Kulicke & Soffa Investments Inc.

Owner at Publication
03
Wilmington, DE

FLIP CHIP TECHNOLOGIES, LLC

New Owner After Publication #1
03
Phoenix, AZ

Legal Representation

Attorney
Bryna S. Silver

USPTO Deadlines

No Upcoming Deadlines

No upcoming deadlines found for this trademark.

Application History

18 events
Date Code Type Description Documents
Feb 4, 2005 MAB6 O ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED Loading...
Feb 4, 2005 ABN6 S ABANDONMENT - NO USE STATEMENT FILED Loading...
Oct 19, 2004 DOCK D ASSIGNED TO EXAMINER Loading...
Oct 6, 2004 COAR I TEAS CHANGE OF OWNER ADDRESS RECEIVED Loading...
Sep 7, 2004 DOCK D ASSIGNED TO EXAMINER Loading...
Jun 25, 2004 TCCA I TEAS CHANGE OF CORRESPONDENCE RECEIVED Loading...
May 15, 2004 EX1G S SOU EXTENSION 1 GRANTED Loading...
May 7, 2004 EXT1 S SOU EXTENSION 1 FILED Loading...
May 13, 2004 CFIT O CASE FILE IN TICRS Loading...
May 7, 2004 EEXT I SOU TEAS EXTENSION RECEIVED Loading...
Nov 11, 2003 NOAM O NOA MAILED - SOU REQUIRED FROM APPLICANT Loading...
Aug 19, 2003 PUBO A PUBLISHED FOR OPPOSITION Loading...
Jul 30, 2003 NPUB O NOTICE OF PUBLICATION Loading...
Jun 17, 2003 CNSA P APPROVED FOR PUB - PRINCIPAL REGISTER Loading...
May 2, 2003 CRFA I CORRESPONDENCE RECEIVED IN LAW OFFICE Loading...
May 2, 2003 MAIL I PAPER RECEIVED Loading...
Jan 9, 2003 GNRT F NON-FINAL ACTION E-MAILED Loading...
Dec 31, 2002 DOCK D ASSIGNED TO EXAMINER Loading...

Detailed Classifications

Class 009
SEMICONDUCTOR PACKAGING FOR MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS, NAMELY, UNDER BUMP METALIZATION, POLYMER THIN FILM LAYERS AND SOLDER BUMPS CONSTRUCTED ON SEMICONDUCTOR WAFER TO PROTECT THE INTEGRATED CIRCUIT FROM CONTAMINANTS AND MOISTURE AND TO MAKE AN ELECTRICAL CONNECTION BETWEEN THE INTEGRATED CIRCUIT CHIP AND PRINTED CIRCUIT BOARD OR OTHER SUBSTRATES
First Use Anywhere: 0
First Use in Commerce: 0

Classification

International Classes
009